Development of a novel filled no-flow underfill material for flip chip applications

Prabhakumar, A.; Rubinsztajn, Sławomir; Buckley, Daniel H.; Campbell, John R.; Sherman, Donna; Esler, David; Fiveland, Eric; Chaudhuri, Arun; Tonapi, Sandeep

doi:10.1109/eptc.2003.1271560

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Nanotechnology and Nanoelectronics2

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“…Many studies have investigated nano-fi lled encapsulants [35][36][37][38][39][40][41]. Nano-particles can be added as fi llers to improve the properties of the encapsulant material.…”

Section: Nanotechnology and Nanoelectronicsmentioning

confidence: 99%

“…Novel nano-silica fi lled NFU materials developed by General Electric has shown to exhibit lower CTE, improved fl uxing properties, transparency and suitable curing kinetics necessary for good quality solder joint formation [35]. The size of the nano-particles used ranged from 5 to 100 nm, but 20 nm particles appeared to provide the optimum balance of material properties.…”

Section: Nanotechnology and Nanoelectronicsmentioning

confidence: 99%

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Trends and Challenges

Ardebili

Pecht²

2009

Encapsulation Technologies for Electronic Applications

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“…Many studies have investigated nano-fi lled encapsulants [35][36][37][38][39][40][41]. Nano-particles can be added as fi llers to improve the properties of the encapsulant material.…”

Section: Nanotechnology and Nanoelectronicsmentioning

confidence: 99%

Section: Nanotechnology and Nanoelectronicsmentioning

confidence: 99%