Development of a novel polymer–metal nanocomposite obtained through the route of in situ reduction for integral capacitor application

Abstract

ABSTRACT:Metal nanoparticles exhibit a number of interesting characteristics, including unique physical, chemical, optical, magnetic, and electric properties. Numerous investigations have exploited their properties in a readily usable form by incorporating them into polymers. The current focus of interest is the behavior of such polymer nanocomposites near the percolation loading levels of the metal nanoparticles. This material is particularly suitable for the new integral passive technology. Discrete capacitors are used in many applications, such as noise suppression, filtering, tuning, decoupling, bypassing, termination, and frequency determination, and they occupy a substantial amount of surface area on a substrate. Thus there are limitations in the number of capacitors that can be placed around the chip. Integral passive components are gradually replacing discrete components because of the inherent advantages of improved electrical performance, increased real estate on the printed wiring board, miniaturization of interconnect distance, reduced processing costs, and efficient electronics packaging. For integral capacitors, polymer composite material has emerged as a potential candidate because it meets the requirements of low processing temperature and reasonably high dielectric constant. Yang and Wong, whose patent was filed in 2001, demonstrated novel integral passive component materials with extraordinarily high dielectric constants (K Ͼ 1000) and high reliability performance. These materials are characterized by high dielectric constant based on the mechanism of interfacial polarization, although they need precision filler concentration control. The current study overcomes this drawback and produces the composite through an in situ reduction in an epoxy matrix. Material characterization was done through TEM, SEM, X-ray analysis, and energy-dispersive analysis for X rays.

Synthesis of Nanosilver/PMMA Composites Via Ultrasonically Bi-In situ Emulsion polymerization

“…The corresponding selected area electron diffraction was shown in the inset of Figure 6, four diffractive cycles whose diffraction angles from 10 to 80 in the ED pattern were observed. It was accordant with result reported by the Pothukuchi's [16], which indicates that the nanosilver as core is polycrystalline. Particularly, the lattice fringes shown in the inset of Figure 5 revealed that the crystalline of the nanosilver within the nanocomposites was highly ordered.…”

Low Electrical Percolation Threshold of Silver and Copper Nanowires in Polystyrene Composites

“…We believe that nanocomposites containing high-aspect-ratio conductive metal nanoparticles should be considered as alternatives to carbonnanotube composites for use in electrostatic dissipation, electromagnetic interference, and other electronic applications, such as heat sinks, that utilize the good thermal conductivity of metals. [15,16] For example, a few studies have been dedicated to the preparation and characterization of epoxy filled with spherical silver nanoparticles for applications such as in embedded capacitors [17][18][19] and electromagnetic shielding. [20] Promising results have been demonstrated.…”

Covalent grafting of a-CNTs on copper phthalocyanine for the preparation of PEN nanocomposites with high dielectric constant and high thermal stability

“…It is an effective method to enhance the dielectric permittivity of polymer through constructing polymer-based composites with high-k and low dielectric loss [4][5][6][7]. This is because high-k polymerbased composites provide an ideal solution to combine the dielectric and electrical properties of the fillers (such as metal particles [8], ceramics [9], carbon based materials [10,11] and semi-conductive oligomer [12], etc.) and the good process compatibility and mechanical properties of polymer matrix.…”