Development of a Quench and Partition Hot Stamping Process for a Third Generation 980 MPa Steel

Abstract

This paper explores the potential to hot stamp third generation steels, in this case a 980 MPa grade, while retaining or improving on the as-received microstructure, in particular the retained austenite (RA) fraction, and corresponding strength and ductility. Three classes of thermomechanical processes were investigated using a thermo-mechanical simulator system (Gleeble 3500). The first two processing routes considered a quenching and partitioning process starting from either a fully austenitic condition prior to quenching, designated the “Q&P” process, or an inter-critical partial austenitic condition, designated the “IC Q&P” process. In the two simulated Q&P processes, the samples were quenched to a predetermined temperature and then immediately transferred to a partitioning furnace. In the third processing route, designated the “Q&T” process, the samples were partially austenitized and then quenched to room temperature, followed by a tempering process to restore ductility. The conventional Q&P process resulted in excessive martensite formation, with high hardness and low ductility. The Q&T process produced a tempered martensite microstructure with hardness equivalent to the as-received sheet but with lower elongation and bendability. The IC Q&P heat treatment process increased the amount of retained austenite compared to the as-received sheet which translated into a higher yield strength, total elongation, and v-bend fracture angle. The IC Q&P ultimate tensile strength was approximately 8% lower than that of the as-received material. A sensitivity study was conducted to evaluate the influence of variations (±25 °C) in the intercritical austenitization temperature, quench temperature, and partitioning temperature on the resulting microstructure and microhardness. The final mechanical properties were observed to be relatively independent of these process variations, indicating that the IC Q&P hot stamping process appears to be robust.