Development of an Easy-debonding Orthodontic Adhesive using Thermal Heating

Tsuruoka, Takashi; Namura, Yasuhiro

doi:10.4012/dmj.26.78

Cited by 20 publications

(16 citation statements)

References 20 publications

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“…It is important that the brackets used for orthodontic treatment be strongly bonded to avoid detachment; however, excessive bond strength can sometimes cause pain in the tooth or cracks in the enamel when the brackets are removed at the end of the treatment 45) . Three-dimensional topographic images obtained by AFM of the enamel surfaces (Fig.…”

Section: Discussionmentioning

confidence: 99%

Atomic force microscopy observation of enamel surfaces treated with selfetching primer

Hashimoto

Nishiura

et al. 2013

Dent. Mater. J.

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Orthodontists use a self-etching adhesive system when attaching brackets to enamel. The purpose of this study was to evaluate the erosion effects of common clinically used adhesive systems on human enamel surfaces by atomic force microscopy (AFM). Four commercially available adhesive systems (i.e., Kurasper F, Beauty Ortho Bond, Orthophia LC, and Transbond XT) were applied to ground enamel surfaces of extracted human teeth. Enamel surface roughness (ESR), absolute depth profile (ADP), and surface hardness were evaluated by AFM. The ESR and ADP were significantly higher after the pretreatment with the phosphoric acidetching adhesive system than after the pretreatments with the three self-etching adhesive systems. The surface nanohardness decreased after the pretreatment with the phosphoric acid-etching adhesive system but increased after the pretreatments with the self-etching adhesive systems. These results suggest that the use of a self-etching primer for enamel conditioning might prevent decalcification caused by phosphoric acid etching.

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Section: Discussionmentioning

confidence: 99%

Atomic force microscopy observation of enamel surfaces treated with selfetching primer

Hashimoto

Nishiura

et al. 2013

Dent. Mater. J.

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“…The remnants exhibit high elastic coefficients and high hardness values due to the inclusion of inorganic fillers. Resins of the 4-methacryloyloxyethyl trimellitate anhydride/methyl methacrylatetri-n-butylborane (4-META/MMA-TBB) type (with no inorganic filler) have been widely adopted in Japan [2], not only as orthodontic adhesives [3,4] but also as a luting material for resin-bonded fixed partial dentures [5][6][7][8]. These resins are easy to remove because of the lack of filler but are inconvenient to handle due to the chemical curing required.…”

Section: Introductionmentioning

confidence: 99%

Effects of composition on the hardness of orthodontic adhesives

et al. 2020

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Although there have been improvements in bracket systems precoated with adhesive, removal of adhesive remnants continues to be problematic. This study compared the hardness and maintainability of precoated adhesive with other commercial adhesives. Knoop hardness values were measured after light-or chemical-induced initial curing, immersion in distilled water at 37°C for 24 h and 1,000 and 10,000 thermal cycles after 24 h. Additionally, the forces required to move brackets by 0.5 mm were measured during bracket positioning, and brackets bonded to bovine enamel were examined by field-emission scanning electron microscopy. The Knoop hardness values of the precoated adhesives were lower than those of commercial resin composite adhesives, and hardness was dependent on the amount of filler in the resin matrix. The ability to maintain the device position may depend on the resin matrix composition. Precoated adhesives with less filler and more matrix material are light curable, and remnant resin may be easily removed.

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“…Tsuruoka et al [43] incorporated thermally expandable microspheres (TEMs) into 4-META/MMA-TBB (4-methacryloxyethyl trimellitate anhydride in methyl methacrylate initiated by tri-n-butyl borane) resin adhesive, which is widely used for bonding orthodontic brackets. The microspheres used in this study were Matsumoto F-36D which starts to expand at 80 ⁰C.…”

Section: Functional Additivesmentioning

confidence: 99%

Overview of disbonding technologies for adhesive bonded joints

Hutchinson

Liu

2016

The Journal of Adhesion

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The ability to separate adhesive bonded assemblies without causing damage to the substrates is clearly very desirable. There are many applications such as in electronics, medical surgery, dentistry, building and general manufacturing where the opportunity to separate assemblies is important.This may be for repositioning in manufacturing, repair in service or recovery of materials at end-of-life. Various methods for adhesive reversibility or disbonding have been proposed over the last 40 years but there currently exist no universally accepted solutions for disbond-on-demand bonded applications. This paper considers the motivation for disbonding, theA c c e p t e d M a n u s c r i p t 2 requirements and considerations associated with possible methods, and the overall effectiveness of the various mechanisms in the context of nonstructural, semi-structural and structural joints. The range of technologies and mechanisms is reviewed, together with the associated methods for activation.The variety of methods is evaluated for their effectiveness in the context of different applications. Particular attention is given to the adverse effects on the performance of bonded assemblies in service, and the ways of mitigating these effects. It is shown that a total materials system approach must be adopted when seeking a disbonding technology for a particular set of circumstances.

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Development of an Easy-debonding Orthodontic Adhesive using Thermal Heating

Cited by 20 publications

References 20 publications

Atomic force microscopy observation of enamel surfaces treated with selfetching primer

Atomic force microscopy observation of enamel surfaces treated with selfetching primer

Effects of composition on the hardness of orthodontic adhesives

Overview of disbonding technologies for adhesive bonded joints

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