Development of an organic micromachined isolation scheme for wafer-level packaging

Venkateshan, A.; Pham, Anh-Vu; Harriss, J.E.

doi:10.1109/epep.2002.1057895

Cited by 1 publication

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The low-temperature process could be used to create 3-D circuit components. Venkateshan et al [13] proposed using SU-8 in a micromachined isolation scheme where walls of SU-8 separated patch antennas and the isolation improvement was measured.…”

Section: Introductionmentioning

confidence: 99%

Micromachining of Air-Bridges on SU-8 Substrates

Miller

Harriss

Pearson

2008

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

This paper describes a procedure developed to fabricate air-bridges on coplanar transmission lines using a SU-8 substrate. SU-8 is attractive for micromachined multilayer circuit fabrication because it is photo-polymerizable resin, leading to safe, economical processing. The ability to fabricate air-bridges provides a means of suppressing the coupled slotline mode, thereby enabling single-mode design. The air-bridges also provide ground equalization at coplanar discontinuities. The properties of the air-bridge are investigated and compared to similar structures without air-bridges. As examples of possible device applications of this technology, an asymmetrical slot antenna and coplanar waveguide both operating at 35 GHz are presented. The return loss of both devices is 5 dB lower on structures that contain the air-bridge. This technology is promising for extending the use of SU-8 at millimeter-wave frequencies.

show abstract

Section: Introductionmentioning

confidence: 99%