Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization

Abstract

This study aims to establish an accurate prediction model using artificial neural networks (ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip-scale package (FCCSP). To enhance model performance, a novel subdomain-based sampling strategy and Taguchi hyperparameter optimization are proposed in the ANN algorithm. To simulate the warpage behavior the FCCSP during fabrication, a process modeling approach is proposed, where the viscoelastic behavior of the epoxy molding compound is included, in which the viscoelastic properties are determined using dynamic mechanical measurement. In addition, the temperature-dependent thermal-mechanical properties of the materials in the FCCSP are assessed through thermal-mechanical analysis and dynamic mechanical analysis. The modeled warpage results are verified by the warpage measurement. Next, warpage parametric analysis is performed to identify the key factors most affecting warpage behavior for use in the construction of the warpage prediction model. Moreover, the advantages of the proposed sampling and hyperparameter tuning approaches are proved by comparing with other existing models, and the validity of the developed ANN-based deep learning warpage prediction model is demonstrated through a validation dataset.

Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging

“…To macroscopically and thermomechanically describe multimaterial and multiscale circuit laminates, the most common effective approach is the simple linear (inverse) ROM estimate [14][15][16][17][18][19], namely, the Voigt (constant strain) and Reuss (constant stress) approximations. This approach has been broadly applied in the thermal or thermomechanical characterization of RDLs [16], PCBs [20], IC substrates [21], and underfill/bump layers [22,23] in microelectronics packaging due to its simplicity and ease of implementation. Unfortunately, this approach mostly lacks accuracy because of its inability to handle the elastic heterogeneity and anisotropy of circuit laminates, which are essentially two of the leading root causes of thermally induced warpages and material failures in electronic packages.…”