2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654415
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Development of Antenna on FO-WLP

Serine Soh Siew Boon
1
,
David Ho Soon Wee
2
,
Hsiao Hsiang Yao
3
et al.
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Cited by 6 publications
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Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

Zhong
1
2020
Materials and Manufacturing Processes
58
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Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

Zhong
1
2020
Materials and Manufacturing Processes
58
0
8
0
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Automated Design Flow for Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging

Wang
1
,
Dutta
2
,
Xie
3
et al. 2019
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
2
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Fan-Out Wafer Level Packaging Development Line

Tc
1
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Ho
2
,
Sc
3
et al. 2020
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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