Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
DOI: 10.1109/iemt.1995.541004
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Development of Au-Al solid phase diffusion flip chip bonding

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Cited by 3 publications
(4 citation statements)
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“…Figure shows the SEM/EDX analysis of the sample, where Al islands have formed on the Au surface. Al from the A layer separating Ti 2 N was diffused out into the deposited Au layer similar to previously reported cases of the Au intercalation into other M n +1 AX n phase carbides with A = Si, Al, and Ga. ,− Interdiffusion between Au and Al is active at our annealing temperature. , Moreover, Al atoms are loosely bonded to Ti in the Ti 2 AlN crystal. Thus, in the presence of Au covering Al, the diffusion of Al into Au occurs as Al atoms have a lower chemical potential in an Au reservoir than in the Ti 2 AlN crystal.…”
Section: Resultssupporting
confidence: 82%
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“…Figure shows the SEM/EDX analysis of the sample, where Al islands have formed on the Au surface. Al from the A layer separating Ti 2 N was diffused out into the deposited Au layer similar to previously reported cases of the Au intercalation into other M n +1 AX n phase carbides with A = Si, Al, and Ga. ,− Interdiffusion between Au and Al is active at our annealing temperature. , Moreover, Al atoms are loosely bonded to Ti in the Ti 2 AlN crystal. Thus, in the presence of Au covering Al, the diffusion of Al into Au occurs as Al atoms have a lower chemical potential in an Au reservoir than in the Ti 2 AlN crystal.…”
Section: Resultssupporting
confidence: 82%
“…It is known that at the elevated temperature, various intermetallic phases are formed as a result of interdiffusion between Au and Al: Al 2 Au, AlAu, AlAu 2 , Al 2 Au 5 , and AlAu 4 . Al 2 Au 5 was found to be initially a predominant phase at 733 K close to our annealing temperature of 773 K. However, it was reported that unstable Al 2 Au 5 rapidly transformed into AlAu 4 at a lower temperature of 673 K . In this work, Al 2 Au 5 , which would form at our annealing temperature, might be transformed into AlAu 4 during cooling.…”
Section: Resultsmentioning
confidence: 59%
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