2015
DOI: 10.1117/1.jmm.14.3.031215
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Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions

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Cited by 10 publications
(3 citation statements)
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“…The corresponding electron temperature are far from the thermal equilibrium. The measured emission angle dispersion is ±10°with respect to the surface normal [11].…”
Section: Applications Of Nc-si Quasiballistic Electron Source (1) Emi...mentioning
confidence: 86%
“…The corresponding electron temperature are far from the thermal equilibrium. The measured emission angle dispersion is ±10°with respect to the surface normal [11].…”
Section: Applications Of Nc-si Quasiballistic Electron Source (1) Emi...mentioning
confidence: 86%
“…4,5 Applying a positive voltage to the top contact, injected electrons are accelerated toward the surface by multiple-tunneling cascade in a chain of nc-Si dots, 6 and then emitted through the surface thin film. In comparison with conventional cold cathodes, there are some advantageous features in this emitter: extremely high mean energies of as-emitted electrons (5-7 eV at an applied voltage of 15-20 V), 4 surface emissivity with a small angle dispersion (±10 • to the surface normal), 7 low sensitivity of emission to ambient pressure, and compatibility with planar process for device fabrication and with active-matrix drive. The usefulness of the nc-Si emitter has been demonstrated in vacuum (parallel electron beam (EB) lithography), 7 in atmospheric-pressure gases (VUV emission from Xe atoms), 8 and in aqueous solutions (H 2 generation).…”
mentioning
confidence: 99%
“…In comparison with conventional cold cathodes, there are some advantageous features in this emitter: extremely high mean energies of as-emitted electrons (5-7 eV at an applied voltage of 15-20 V), 4 surface emissivity with a small angle dispersion (±10 • to the surface normal), 7 low sensitivity of emission to ambient pressure, and compatibility with planar process for device fabrication and with active-matrix drive. The usefulness of the nc-Si emitter has been demonstrated in vacuum (parallel electron beam (EB) lithography), 7 in atmospheric-pressure gases (VUV emission from Xe atoms), 8 and in aqueous solutions (H 2 generation). 9,10 When the nc-Si emitter is driven in metal salt solutions, ballistic hot electrons induces the reductive reaction leading to the deposition of thin metal films.…”
mentioning
confidence: 99%