Development of Chip-on-Dot flip chip technique utilizing Gold Dot/sup TM/ flexible circuitry

Wang, Z.P.; Tan, Ying; Schreiber, C.M.; Tsui, C.C.; Shi, Zhimin; Wei, J.

doi:10.1109/ectc.2000.853406

Cited by 4 publications

(1 citation statement)

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“…These Gold Dot contacts can be implemented with a pitch as close as 0.5 mm and are said to be very effective at 2.5 GHz and higher. Wang et al [5] developed and tested a flex as a connecting method for Chip-on-Dot, using the by Packard-Hughes Interconnect patented Gold Dot technology. Reliable electrical connections are established by pressuring the Gold Dot bumps against corresponding connection pads on the receiving board.…”

Section: Flexible Printed Circuit -Backplane Connectormentioning

confidence: 99%

Solder connections for high frequency applications between flexible and rigid printed circuit boards

Siebert

2006

IEEE Trans. Comp. Packag. Technol.

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This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.

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Section: Flexible Printed Circuit -Backplane Connectormentioning

confidence: 99%