Development of cost effective sampling strategy for in-line monitoring

Tomlinson, W.; Nurani, R.K.; Burns, Michael; Shanthikumar, J. George

doi:10.1109/asmc.1997.630696

Cited by 7 publications

(5 citation statements)

References 1 publication

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“…Among papers surveyed in Table I, note that, even if all papers are applied to a case study of a semiconductor plant, very few provide industrial deployments [21] [26] [29]. In [21], the study performed in an IBM plant to determine the optimal sampling plan for the poly etch module is described.…”

Section: Static or Start Samplingmentioning

confidence: 99%

“…The number of lots to measure depends on the available inspection capacity, the maturity of the technology, and the process step criticality [14]. The frequency and the sensitivity of the measurement are selected in advance, at the start of [18] 1994 * * Nurani et al [19] 1996 * McIntyre et al [20] 1996 * * Tomlinson et al [21] 1997 * * Scanlan et al [22] 1998 * Elliott et al [23] 1999 * Chien et al [24] 2000 * Lee et al [11] 2001 * Chien et al [25] 2001 * * Shumaker et al [26] 2003 * * Xumei et al [27] 2003 * * Wu and Pearn [28] 2006 * * Kwang and Chin [29] 2008 * * production. The objective is to monitor and detect process drifts and limit the material at risk [15] between controls.…”

Section: Static or Start Samplingmentioning

confidence: 99%

“…In [21], the study performed in an IBM plant to determine the optimal sampling plan for the poly etch module is described. The goal is to minimize both the risk for the product and the cost of inspection.…”

Section: Static or Start Samplingmentioning

confidence: 99%

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A Literature Review on Sampling Techniques in Semiconductor Manufacturing

Nduhura-Munga

Rodriguez-Verjan

Dauzère‐Pérès

et al. 2013

IEEE Trans. Semicond. Manufact.

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This paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and dynamic. For each group, a classification is performed per year, approach, and industrial deployment. A comparison between the groups indicates a complementarity strongly linked to the semiconductor environment. Benefits and drawbacks of each group are discussed, showing significant improvements from static to dynamic through adaptive sampling techniques. Dynamic sampling seems to be more appropriate for modern semiconductor plants.

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Section: Static or Start Samplingmentioning

confidence: 99%

Section: Static or Start Samplingmentioning

confidence: 99%

See 1 more Smart Citation

A Literature Review on Sampling Techniques in Semiconductor Manufacturing

Nduhura-Munga

Rodriguez-Verjan

Dauzère‐Pérès

et al. 2013

IEEE Trans. Semicond. Manufact.

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show abstract

“…The selection of these variables is aimed at monitoring the areas of greatest concern on the production line and will be affected by the maturity of the product and the combination of process tools in use. While a good line sampling strategy is of paramount importance to any ILM system, this is not discussed here because it has been thoroughly covered in the literature [3,4].…”

Section: Adjustable Parameters In a Smart Samplementioning

confidence: 98%

Intelligent line monitor: maximum productivity through an integrated and automated line monitoring strategy

Pilon

Burns²,

Fischer³

et al.

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

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This paper describes an Intelligent Line Monitor system and highlights the features which make it superior to conventional line monitor systems. By citing examples from an IBM 0.25pm technology fabricator, we show that an integrated and automated line monitoring strategy reduces time-to-results, provides a low cost-of-ownership, and delivers a short time to return-on-investment. The natural expansion and growth possibilities of such as system are also explored.

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“…The ICs takes data and images fiom inspection tools, clusters them, automatically performs DSA, samples them [3], and automatically classifies the defects in the sample. Clustering defects minimizes the effects of systematic defects on the sampling routine.…”

Section: System Descriptionmentioning

confidence: 99%

All electronic defect inspection, management, and reporting system

White

Brenizer²,

Dao³

et al.

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)

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Described is an essentially all electronic defect inspection, management, and reporting system, integrating defect data, images, and bit maps. It is shown how the system increases the efficiency of inline defect monitoring by utilizing ADC, allowing dispositioning of lots at lower levels in the organization, focusing defect reduction efforts on those defects that affect yield, and shortening failure analysis cycle time.

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Development of cost effective sampling strategy for in-line monitoring

Cited by 7 publications

References 1 publication

A Literature Review on Sampling Techniques in Semiconductor Manufacturing

A Literature Review on Sampling Techniques in Semiconductor Manufacturing

Intelligent line monitor: maximum productivity through an integrated and automated line monitoring strategy

All electronic defect inspection, management, and reporting system

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