Development of Cu Substrate for Low Cost Coated Conductors

Kashima, N.; Shima, Kunihiro; Doi, Toshiya; Kubota, Shuichi; Watanabe, T.; Inoue, Masayoshi; Kiss, Takanobu; Nagàya, Shigeo

doi:10.1109/tasc.2009.2018263

Cited by 15 publications

(8 citation statements)

References 13 publications

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“…Ni-electroplated Cu/SUS316 lamination tapes prepared by Tanaka Kikinzoku Kogyo KK (commercially available) were used as the substrates. An SUS316 tape with a thickness of 100 μm was bonded to a 30-μm-thick {100}<001> textured Cu tape, and a 0.5-μm-thick Ni layer was electro-deposited on the surface of the laminated tape (Ni/Cu/ SUS tape) 26,27) . The crystal orientation of the Ni layer in the Ni/Cu/SUS tape was 5.0 to 5.5 (full width at half maximum (FWHM) value in the X-ray (111) ϕ-scan measurement).…”

Section: Methodsmentioning

confidence: 99%

Fabrication of YBa2Cu3O7 Superconducting Film on {100}<001> Textured Cu Tape via Conductive Buffer Layers

et al. 2017

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Long-length coated conductors (CCs) have recently become commercially available, serving as a promising candidate for use in electric power applications. However, the material and manufacturing costs are high, which discourages their use in a wide range of commercially feasible products. REBa 2 Cu 3 O 7 (REBCO; RE: Y or rare-earth elements) superconducting lms with high critical current density (J c) have been grown on cube-textured metal tapes to develop CCs for high temperature, high magnetic eld applications. In the standard approach, a biaxially oriented YBCO layer is deposited on a Y 2 O 3 /Y 2 O 3-stabilized ZrO 2 /CeO 2 buffered Ni-W tape. CCs become highly resistive when they are quenched; therefore, for reliable and safe application, it is necessary to attach low-resistivity metal layers, such as Cu and/or Ag, to the CCs to stabilize and protect them from damage due to quenching. Presently, insulative oxides are used for the buffer layers; thus, thick Ag and Cu layers are required to be deposited as stabilizer layers on the YBCO layer. However, the high material and process costs for obtaining the Ag and Cu layers are one of the major obstacles to achieving low-cost CCs. The use of conductive buffer layers instead of insulative reduces the cost of CCs. In this paper, we propose a new con guration for CCs: YBCO deposited on a conductive Sr(Ti 0.95 Nb 0.05)O 3 buffered Ni-electroplated {100}<001> textured Cu and SUS316 lamination tape. Sr(Ti 0.95 Nb 0.05)O 3 was epitaxially grown on the Ni-electroplated {100}<001> textured Cu tape, and its resistivity was as low as 2.5 mΩ-cm at 77 K. An excellent J c of 2.6 × 10 6 A/cm 2 was achieved at 77 K under a magnetic selfeld for the YBCO/Sr(Ti 0.95 Nb 0.05)O 3 /Ni/Cu/SUS316 tape. We believe that Sr(Ti 0.95 Nb 0.05)O 3 is a promising candidate for the conductive buffer layer material.

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Section: Methodsmentioning

confidence: 99%

Fabrication of YBa2Cu3O7 Superconducting Film on {100}<001> Textured Cu Tape via Conductive Buffer Layers

et al. 2017

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“…A single-crystal-like Cu film can serve as an inexpensive, highly ordered, and conductive substrate for the epitaxial growth of grain boundary-free electronic materials for catalysts, 19 spintronic devices, 20 and high-temperature superconducting materials. 21 The control of interfacial energies afforded by SAMs enables the epitaxial lift-off of a single-crystal-like metal foil that could serve as a conducting substrate for flexible electronic devices such as wearable solar cells, 22 sensors, 23 and flexible displays. Herein, we show an electrochemical method to produce epitaxial Cu(111) films on the SAM of the amino acid Lcysteine on Au(111) and lift-off of single-crystal-like Cu foils for flexible electronics.…”

Section: ■ Introductionmentioning

confidence: 99%

“…A single-crystal-like metal film refers to a highly ordered metal with specific in-plane and out-of-plane orientations, which can be determined by X-ray analysis. A single-crystal-like Cu film can serve as an inexpensive, highly ordered, and conductive substrate for the epitaxial growth of grain boundary-free electronic materials for catalysts, spintronic devices, and high-temperature superconducting materials . The control of interfacial energies afforded by SAMs enables the epitaxial lift-off of a single-crystal-like metal foil that could serve as a conducting substrate for flexible electronic devices such as wearable solar cells, sensors, and flexible displays …”

Section: Introductionmentioning

confidence: 99%

Epitaxial Electrodeposition of Cu(111) onto an l-Cysteine Self-Assembled Monolayer on Au(111) and Epitaxial Lift-Off of Single-Crystal-like Cu Foils for Flexible Electronics

et al. 2020

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Functional self-assembled monolayers (SAMs) of thiols on single-crystal metals provide two-dimensional (2D) soft templates for the highly ordered growth of crystalline materials. An epitaxial Cu(111) film is electrodeposited on a SAM of the amino acid l-cysteine on Au(111). Epitaxy is confirmed, with Cu(111) following the Au(111) in-plane and out-of-plane orientations with a small amount of twinned [511] orientation, which is shown by X-ray analysis. The mismatch between Cu(111) and the Au(111) substrate is −11.37%. This mismatch is lowered to −0.29% by forming a coincident site lattice in which nine unit meshes of Cu coincide with eight unit meshes of Au. Defect-mediated and coordination-controlled electrodeposition mechanisms are illustrated as two possible deposition mechanisms. The carboxylic (−COOH) and amine (−NH2) functional groups of the l-cysteine molecule are shown to be crucial for the epitaxy of Cu because a 1-butanethiol SAM on Au(111) which has no functional groups yields a textured film with no in-plane order. The (√3 × √3)R30° surface structure of l-cysteine SAM and the c(4 × 2) surface structure of 1-butanethiol SAM on Au(111) are discussed. A 3D model of the Cu lattice on the l-cysteine SAM on Au(111) is proposed. A possible coordination to Cu is shown, which facilitates the epitaxial nucleation and 2D growth of Cu. The Cu(111) films have potential as a substrate for catalysts for CO2 reduction, photovoltaic devices, spintronic devices, and high-temperature superconductors. Direct epitaxial lift-off of the Cu film without etching gives a single-crystal-like Cu(111) foil. The Cu(111) foil exhibits a low resistivity of 3.75 × 10–8 Ω·m and good bending stability, showing only a 12% increase in resistance after 104 bending cycles. Cu(111) foils can be utilized as inexpensive, highly ordered, and conductive substrates for flexible electronics such as wearable solar cells, sensors, and flexible displays. Here, we show an example by electrodepositing epitaxial cuprous oxide on a Cu(111) foil.

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“…This clad is based on a rolling-assisted biaxially textured substrate (RABiTS) of cube-textured copper (30 μm) with a thin electroplated cube-textured nickel layer on it with a thickness of 1 μm, bonded to a stainless steel (SS) tape (80 μm) by surface activated bonding (SAB) technique [24, 27]. The detailed fabrication process has been described in a previous work [24]. The main role of the nickel layer is to act as a barrier layer for copper diffusion and prevent the oxidation of the copper tape [27].…”

Section: Introductionmentioning

confidence: 99%

Epitaxial Growth of SrTiO3 Films on Cube-Textured Cu-Clad Substrates by PLD at Low Temperature Under Reducing Atmosphere

et al. 2017

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The growth of epitaxial {001}<100> SrTiO3 (STO) on low-cost cube-textured Cu-based clad substrate at low temperature was carried out by means of pulsed laser deposition (PLD). STO film was deposited in one step under a reducing atmosphere (5% H2 and 95% Ar mixture) to prevent the oxidation of the metal surface. The optimization of PLD parameters leads to a sharpest biaxial texture at a temperature as low as 500 °C and a thickness of 500 nm with a (100) STO layer. The upper limit of highly textured STO thickness was also investigated. The maximum thickness which retains the best quality {001}<100> texture is 800 nm, since the texture is preserved not only through the layer but also on the surface. Atomic force microscopy (AFM) and scanning electron microscopy (SEM) measurements showed that STO films are continuous, dense, and smooth with very low roughness (between 5 and 7 nm). This paper describes the development of STO layer by means of PLD in absence of oxygen throughout the process, suggesting an alternative and effective method for growing highly {001}<100> textured STO layer on low-cost metal substrates.

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Development of Cu Substrate for Low Cost Coated Conductors

Cited by 15 publications

References 13 publications

Fabrication of YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub> Superconducting Film on {100}<001> Textured Cu Tape via Conductive Buffer Layers

Fabrication of YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub> Superconducting Film on {100}<001> Textured Cu Tape via Conductive Buffer Layers

Epitaxial Electrodeposition of Cu(111) onto an l-Cysteine Self-Assembled Monolayer on Au(111) and Epitaxial Lift-Off of Single-Crystal-like Cu Foils for Flexible Electronics

Epitaxial Growth of SrTiO3 Films on Cube-Textured Cu-Clad Substrates by PLD at Low Temperature Under Reducing Atmosphere

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