Development of evaluation method that takes into account the effect the fine structure of adhesive interface for delamination strength of the packaging resin

Furuyama, Yukichi; Honda, Okihisa; Yu, Qiang

doi:10.1109/eptc.2016.7861580

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) 2016

DOI: 10.1109/eptc.2016.7861580

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Development of evaluation method that takes into account the effect the fine structure of adhesive interface for delamination strength of the packaging resin

Yukichi Furuyama

Okihisa Honda

Qiang Yu

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Development of evaluation method that takes into account the effect the fine structure of adhesive interface for delamination strength of the packaging resin

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References 2 publications

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