Strong ultraviolet electroluminescence with an external quantum efficiency above 1% is observed from an indium-tin oxide/SiO 2 : Gd/ Si metal-oxide-semiconductor structure. The SiO 2 : Gd active layer is prepared by thermal oxidation followed by Gd + implantation and annealing. The electroluminescence spectra show a sharp peak at 316 nm from the 6 P 7/2 to 8 S 7/2 transition of Gd Light sources operating in the ultraviolet (UV) region are required for a number of applications, including solidstate lighting, biological agent detection, sterilization, and covert communication. Strong UV light emission from AlGaN-based emitters has been reported emitting in the UV range from 265 to 325 nm.1-3 However, for the development of microlight sources for on-chip analysis, such as biochips, biosensors, microflorescent displays, etc., efficient siliconbased microlight sources are required which can be integrated into silicon integrated circuits. Silicon-based UV light emitters are promising for such applications. Recently, light emitters incorporating rare-earth Er 3+ -, Tm 3+ -, Tb 3+ -, and Ce 3+ -doped Si-rich SiO 2 have been reported with emission in the infrared to blue-green spectral regions.4,5 Strong blueviolet emission at 390 nm has been reported in Ge 3+ -implanted SiO 2 metal-oxide-semiconductor (MOS) structures.6 Efficient silicon-based UV light emitters at a shorter wavelength from silicon device have not yet been reported for the time being. In this letter, we demonstrate a silicon-based efficient UV light emitter based on a SiO 2 :Gd MOS structure delivering a sharp emission peak at 316 nm from Gd 3+ ions, which is comparable to the efficient UV emission of ZnF 2 : Gd.7 External quantum efficiencies above 1% are achieved with not fully optimized devices. Device sizes below 1 m can be easily achieved with standard complementary MOS (CMOS) technology.Electroluminescent (EL) devices are prepared by standard silicon CMOS technology on 4 in. n-type silicon wafer with resistivity of 2 -5 ⍀ cm. The structure consists of an active gate oxide area surrounded by a field oxide (1 m thick). The active layer is a 100 nm thick thermally grown SiO 2 layer implanted with Gd + ions at two energies of 50 and 110 keV with doses of 5 ϫ 10 14 and 1 ϫ 10 15 cm −2 , respectively. After annealing at 800°C for 1 h, a plasma treatment was performed in a mixture of oxygen/hydrogen (90/ 10) for 5 min. The gate electrode consists of a 100 nm thick indiumtin oxide (ITO) deposited by rf sputtering. Various shapes of MOS structures with different feature sizes in the range of 1 to 500 m were fabricated for testing the function of the EL devices dependent upon the geometry.EL spectra were measured on a MOS structure with 500 m diameter with a constant current supplied by a sourcemeter (Keithley 2410). EL signals were recorded at room temperature with a monochromator and a photomultiplier. The absolute EL power from the device was measured using a calibrated optical power meter. The external EL power efficiency is calculated by integrating the...