2014
DOI: 10.1016/j.jcrysgro.2013.10.021
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Development of grain structures of multi-crystalline silicon from randomly orientated seeds in directional solidification

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Cited by 47 publications
(20 citation statements)
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“…This would result in low density of dislocation clusters thanks to the interaction of blocking mechanisms by which dislocations that nucleate at the beginning of the crystallization process cannot propagate further along the growth of the ingot. In the literature, chips [15] (small Si pieces) and granules [16,17] (small spherical Si beads) have been reported to be used as seeds for HP mc-Si ingot growth with promising results. However, from the work presented on the literature, we can conclude that it is essential to better understand and control the initial grain size and orientation distribution at both bottom and walls of the crucible, as well as the initial defect density to obtain the targeted dislocation density reduction higher in the ingot [18].…”
Section: Introductionmentioning
confidence: 99%
“…This would result in low density of dislocation clusters thanks to the interaction of blocking mechanisms by which dislocations that nucleate at the beginning of the crystallization process cannot propagate further along the growth of the ingot. In the literature, chips [15] (small Si pieces) and granules [16,17] (small spherical Si beads) have been reported to be used as seeds for HP mc-Si ingot growth with promising results. However, from the work presented on the literature, we can conclude that it is essential to better understand and control the initial grain size and orientation distribution at both bottom and walls of the crucible, as well as the initial defect density to obtain the targeted dislocation density reduction higher in the ingot [18].…”
Section: Introductionmentioning
confidence: 99%
“…have been previously studied in cast multi-crystalline silicon ingots by Electron Backscattered Diffraction (EBSD) [15,16]. In particular, the importance of twinning in the development of the grain structure has been highlighted for different solidification processes ranging from directional solidification [17] to ribbon growth [18].…”
Section: Introductionmentioning
confidence: 99%
“…To further explain the more realistic situation of the three-grain tri-junctions (3GTJ) on the interface during ingot growth, Jain et al [14], further developed a three-dimensional model, referred as Jain's model. With the 3GTJ model, the twinning from certain grains during mc-Si growth experiments [15] was correctly predicted. More importantly, the required undercooling for twining was in the order of 0.3 K, which was consistent with the measured value [2,13].…”
Section: Introductionmentioning
confidence: 88%