Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

Yeh, C. Y.; Wang, J. Y.; Wu, Chi-Wei; Chiu, Chung Yu; Lee, C. H.; Huang, Bo; Fu, Kuo-Ching; Chang, J. S.; Yen, T. H.; Lee, Y. F.; Liu, C. Y.

doi:10.1007/s10854-022-09256-9

Cited by 2 publications

(1 citation statement)

References 21 publications

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“…In electronic packaging industries [1], Pb-free Sn-Ag solders have been widely utilized for chip joint processing during the manufacturing of cheaper large-volume consumer products owing to their reasonable costs, good soldering performance, superior mechanical properties, as well as high resistance to thermal fatigue [2,3]. One of the notable reliability challenges in the context of lead-free Sn-based solder alloys is the formation of brittle intermetallic compounds (IMCs) [3][4][5][6][7][8]. The formation of Cu 6 Sn 5 IMCs in Sn/Cu, Sn-Ag/Cu, and Sn-Ag-Cu/Cu during reflow soldering is mainly governed by the grain boundary diffusion of Cu into the solder, and this is again influenced by the interfacial grain orientation or Ag 3 Sn nano-particles in cooling stage [2,[9][10][11][12][13].…”

Section: Introducementioning

confidence: 99%

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Guo

Kunwar

et al. 2023

Metals

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Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio.

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Section: Introducementioning

confidence: 99%

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Guo

Kunwar

et al. 2023

Metals

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Influence of Ag and Zn on the Microstructure and Properties of Sn-40 Bi Alloy for Improved Soldering Applications

Shen

2024

ACS Appl. Electron. Mater.

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In this study, the effect of adding 2 wt % of Ag and Zn on the microstructural characteristics and properties of Sn−40 Bi alloy (SB40), focusing on mechanical, thermal, and soldering behaviors, was investigated. Microstructural analyses revealed Snand Bi-rich phases in SB40, SBA402, and SBZ402. Notably, SBZ402 exhibited a needle-like Zn-rich phase, while SBA402 contained a small amount of Ag 3 Sn. SBA402 exhibited the highest tensile strength of 78.1 MPa, which can be attributed to its finer microstructure and solid solution strengthening. Ag and Zn additives can lower the liquidus onset temperature of SB40, thereby influencing its soldering characteristics. Interfacial reactions showed that SBA402/Cu had a uniform and very thin interlayer of Cu 6 Sn 5 (Ag) ideal for soldering, in contrast to the interfacial voids in SBZ402/Cu. Phase diagram calculations elucidated the microstructural and thermal properties and the formation of interfacial intermetallic compound (IMC). These findings suggest that SBA402 can be favorably used in soldering applications.

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Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

Cited by 2 publications

References 21 publications

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Influence of Ag and Zn on the Microstructure and Properties of Sn-40 Bi Alloy for Improved Soldering Applications

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