Development of high performance bonding machines with improved motion control and intelligent fine tuning algorithm

Abstract

Motion related bonding accuracy study is needed to build up the correlation between motion tracking performance and bonding accuracy. Based on links between bonding specifications and motion performance, grading can be given to motion performance to represent acceptable bonding accuracy. A diagnostic tool is developed to check motion performance periodically and fine tune motion performance to healthy condition in case motion performance is not good or healthy enough for accurate bonding. An intelligent approach is promoted in this paper to fine tune parameters to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a solution to optimize motion system performance on bonding machines, so as to further improve bonding performance. The idea proposed in this paper helps on development and smooth mass production of semiconductor packaging equipment. Two Difficulties in Bonding and MotionTo help on better bonding accuracy, people from bonder product group side tend to ask for perfect motion tracking, i.e., zero tracking errors in both dynamic and settling stages of a motion related to bonding, which is an impossible task to be achieved by engineers from motion group side. No matter how good the motion performance is, it cannot satisfy people from bonder product group as it's not and will never be perfect. Motion related bond accuracy study is needed for both sides to better understand the correlation between motion tracking error and bonding accuracy.It's always difficult to satisfy both strict requirements of dynamic performance and settling performance of highprecision and high-acceleration point-to-point motions on bonding machines, i.e., Die bonders, Wire bonders, Flipchip bonders, Wafer bumping machines, and so on.Studies presented in this paper try to find answers for two questions: Can the correlation between bonding performance and motion performance be quantified? The first part of this paper tries to give an example on this correlation. And, after the correlation is confirmed, we face the 2nd problem: how to improve and maintain motion performance to suit consistent bonding performance for hundreds of bonding machines in mass production? An intelligent fine tuning approach is introduced in this paper.Quite a few papers study bonding accuracy and motion control tracking performance. But few discussions try to find the correlation between these two and how to fine tune motion performance on bonders to meet bonding accuracy requirements. To protect core technology, international bonder makers seldom publish their study and progress on this topic. An automation technique is presented by Timothy P. K. (Drexel University), which yields high-performance, low-cost optoelectronic alignment and packaging through the use of intelligent control theory and system-level modeling. The approach is based on model-based control, to build an a priori knowledge model, specific to the assembled package's optical power p...

Fuzzy Fine Tuning Therapies for Intelligence of High Speed Electronic Packaging Equipment

“…[1-2, 4-8, 10-11] Fuzzy logic feedforward fine tuning was roughly introduced by the authors. [12] Before fuzzy logic is introduced, we must find the rules how FFC parameters influence motion performance while motion profile (i.e., motion distance, motion maximum velocity, and motion maximum acceleration) and other motion conditions are pre-determined. It's difficult to theoretically map FFC parameters to the dynamic motion tracking system.…”