Development of High Speed Lead Plating and its Applications

Graham, A. Kenneth; Pinkerton, Harry

doi:10.1080/00202967.1964.11869930

Cited by 3 publications

(6 citation statements)

References 2 publications

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“…They depend on the load and the measuring time. Typical values for the Knoop hardness with a load of 25 g are in the range of 4 [49]. For a load of 5 g, the hardness is given as 7-8 [44].…”

Section: Hardnessmentioning

confidence: 99%

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Electrodeposition of Lead and Lead Alloys

Jordan¹

2010

Modern Electroplating

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The standard potential for lead in aqueous solutions is À0.12 V. This metal has a high hydrogen overpotential, which means that it is easily deposited electrolytically from strongly acidic solutions with a cathodic efficiency approaching 100%. The values for the hydrogen overpotential are dependent on the surface and structure of the electrode and are given in the literature as varying between 0.84 V for 99.8% pure Pb [1] to about 1.2 V for electrolytically deposited coatings [2].The electrochemical equivalent for the reaction Pb 2þ þ 2e ! Pb ð8:1Þis 3.865 g Ah À1 . The lead deposition can be used for coulometric determinations because of the high cathodic current efficiency.

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“…They depend on the load and the measuring time. Typical values for the Knoop hardness with a load of 25 g are in the range of 4 [49]. For a load of 5 g, the hardness is given as 7-8 [44].…”

Section: Hardnessmentioning

confidence: 99%

“…The corrosion resistance of electrodeposited lead coatings was investigated by Graham and Pinkerton [49] in atmospheric exposure tests in severe industrial, rural, and maritime climates. Coatings with thicknesses of 25 and 50 mm on steel panels did not show base material corrosion after three years.…”

Section: Corrosion Resistancementioning

confidence: 99%

Electrodeposition of Lead and Lead Alloys

Jordan¹

2010

Modern Electroplating

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“…The possibility of AgPd alloys electrodeposition from the solution containing high concentration of chloride ions (12 mol dm -3 LiCl) was first mentioned by Brenner, 1 considering the results obtained by Graham et al 2,3 for the electrodeposition of AgPt alloys. It was shown later [4][5][6][7] that in the excess of chloride ions AgCl could dissolve to the concentrations sufficient for the electrodeposition of AgPd alloys, with Pd electrodeposition starting at more positive potentials than Ag.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical deposition and characterization of AgPd alloy layers

Elezović

Żabiński

Krstajić-Pajić³

et al. 2018

JSCS

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The AgPd alloys were electrodeposited onto Au and glassy carbon disc electrodes from the solution containing 0.001 mol dm-3 PdCl2 + 0.04 mol dm-3 AgCl + 0.1 mol dm-3 HCl + 12 mol dm-3 LiCl under the non-stationary diffusion (quiescent electrolyte) and convective diffusion (? = 1000 rpm) to the different amounts of charge and at different current densities. Electrodeposited alloy layers were characterized by the anodic linear sweep voltammetry (ALSV), scanning electron microscopy, energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The compositions of the AgPd alloys determined by the EDS were almost identical to the theoretically predicted ones, while the compositions obtained by XPS and ALSV analysis were similar to each other, but different from those obtained by EDS. Deviation from the theoretically predicted values (determined by the ratio jL(Pd)/j(Ag)) was more pronounced at lower current densities and lower charges of AgPd alloys electrodeposition, due to the lower current efficiencies for alloys electrodeposition. The ALSV analysis indicated the presence of Ag and Pd, expressed by two ALSV peaks, and in some cases the presence of the additional peak, which was found to correspond to the dissolution of large AgPd crystals, formed at thicker electrodeposits (higher electrodeposition charge), indicating, for the first time, that besides the phase structure, the morphology of alloy electrodeposit could also influence the shape of the ALSV response. In addition to Ag and Pd, the XPS analysis confirmed the presence of AgCl at the surface of samples electrodeposited to low thicknesses (amounts of charge). [Project of the Serbian Ministry of Education, Science and Technological Development, Grant no. 172054]

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“…In his comprehensive treatise (3), Brenner reviewed the unsuccessful attempts up to that time to electroplate the Ag-Pd alloy from various baths. He commented, however, that the concentrated chloride bath, investigated by Graham et al (4) for Ag-Pt alloy plating, should also be feasible for Ag-Pd alloy plating. Although the latter (4) mentioned briefly that they had obtained Ag-Pd alloy from a * Electrochemical Society Active Member.…”

mentioning

confidence: 99%

“…3 Present address: Oxy Metal Industries, Warren, Michigan 48089. 4 The product of a density factor (11.3/19.3 = 0.59) and a price factor $130/$390. similar bath, they gave no details.…”

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confidence: 99%

Development of Silver‐Palladium Alloy Plating for Electrical Contact Applications

Cohen

Walton

Sard

1984

J. Electrochem. Soc.

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Silver‐palladium alloys were electroplated as high quality coatings from a concentrated chloride bath. Adherent, uniform, and coherent deposits were obtained with thicknesses of up to 20 μm. The alloys were found to be homogenous, single‐phase solid solutions, with palladium content ranging from about 30% to 60%, depending on the operating variables. The microstructure of the plated Ag‐Pd alloys consists of very fine grains (100–300Å). These alloys have a fcc crystal structure, and the lattice parameter varies continuously with composition. The useful plating rate with moderate agitation was found to be about 0.44 μm/min at 10 mA/cm2, which is almost twice that of conventional cobalt‐hardened gold, due to the current efficiency of nearly 100%. Alloys containing about 40% Pd were obtained with these conditions. High speed plating of the Ag‐Pd alloy was achieved in a forced flow cell up to rates of about 9 μm/min. To achieve satisfactory deposits, it was generally necessary to use a thin (0.2–0.4 μm) soft gold underplating. Preliminary tests of electrical contact properties revealed that the Ag‐Pd coatings possessed low contact resistance (about 1 mΩ at 100g load). Other relevant properties include intermediate Knoop microhardness (about 200 kg/mm2 at 25g load) and an excellent resistance to formation of corrosion films in accelerated tests using flowers of sulfur. The present study indicates that the plated Ag‐Pd coatings are superior in contact resistance stability to the bulk wrought alloy R156 (40%Ag‐60%Pd). Finally, these coatings show satisfactory wear response in the selected tests provided a hydrocarbon lubricant is present.

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Development of High Speed Lead Plating and its Applications

Cited by 3 publications

References 2 publications

Electrodeposition of Lead and Lead Alloys

Electrodeposition of Lead and Lead Alloys

Electrochemical deposition and characterization of AgPd alloy layers

Development of Silver‐Palladium Alloy Plating for Electrical Contact Applications

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