Development of highly reliable low temperature curable photosensitive polyimide

Tomikawa, Masao; Masuda, Yuki; Shoji, Yu; Matsumura, Kazuyuki; Okuda, Ryoji

doi:10.23919/panpacific.2018.8319010

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Masao Tomikawa1

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2020

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“…They examined Cu atom and ion diffusion into the polyimide layer, and the void formation between Cu and polyimide mechanism. They found that the void was formed due to the diffusion-rate difference in Cu atom and Cu ion [9]. The study of the Cu-void formation is quite important for the material development.…”

Section: Masao Tomikawamentioning

confidence: 99%

The Photopolymer Science and Technology Award

Tomikawa

2020

J. Photopol. Sci. Technol.

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The Photopolymer Science and Technology Award No. 201100, the Outstanding Achievement Award 2020 was presented to Dr. Masao Tomikawa for his outstanding achievements in photo definable polyimides science and technology including the photo reaction mechanism of the Ionic-bonded-photosensitive polyimide, and the pioneering development of positive photo definable polyimide by partial esterification of poly(amic acid) for semiconductor stress buffer and for the organic light emitting diode (OLED) displays. In addition, he contributed the Cu compatibility study for the improvement to long time reliability of the polyimide and Cu interconnection.

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Section: Masao Tomikawamentioning

confidence: 99%