Development of highly wear resistant Cu - Al alloys processed via powder metallurgy

Shaik, Mahammad Ali; Golla, Brahma Raju

doi:10.1016/j.triboint.2019.03.055

Cited by 50 publications

(28 citation statements)

References 42 publications

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“…Copper is an important engineering material used in electrical and electronic industries, due to its excellent electrical and thermal conductivity [1,2,3,4,5,6,7,8]. Copper based composite materials, which contain hard ceramic particles aiming to either improve the tribological properties or decrease the coefficient of thermal expansion of copper matrix, have recently attracted the interest of many researchers [4,5,6,7,8]. These materials are difficult to machine and are mostly fabricated via powder metallurgy, which can provide net-shape fabrication [9,10,11,12].…”

Section: Introductionmentioning

confidence: 99%

The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

et al. 2019

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In this study, effects of sintering temperature and TiH2 on the sintering process of Cu are investigated. During sintering, the oxide in Cu decomposes and generates oxygen, which can become trapped in the material forming closed pores. Therefore, this results in low sintered density. Sintering behavior of Cu can be significantly improved by adding 0.5 wt.% TiH2 which decomposes during sintering, producing hydrogen and effectively reducing the oxide in Cu. Although gas products of the reduction reaction may still be trapped inside the close pores formed near the TiH2 particles and handicap the sintering of Cu, an isothermal treatment at 650 °C can avoid forming close pores. This allows reaction products to dissipate freely from the sample, subsequently increasing its sintered density.

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Section: Introductionmentioning

confidence: 99%

The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

et al. 2019

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“…Cu–Al alloys are known for their excellent wear resistance in comparison with other copper alloys. [ 51 ] From Section 3.1 one might expect that an interfacial film comprised of a layer with a lower shear strength than the contacting bodies lowers the coefficient of friction. Since the amount of such wear particles is not sufficient to form a uniform, closed layer, these properties most likely do not contribute in a considerable way to the overall tribological performance.…”

Section: Discussionmentioning

confidence: 99%

How Tribo‐Oxidation Alters the Tribological Properties of Copper and Its Oxides

Lehmann

Schwaiger

Rinke

et al. 2020

Adv Materials Inter

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Tribochemical reactions in many applications determine the performance and lifetime of individual parts or entire engineering systems. The underlying processes are however not yet fully understood. Here, the tribological properties of copper and its oxides are investigated under mild tribological loading and for dry sliding. The oxides represent the late stages of a copper–sapphire tribo‐contact, once the whole copper surface is covered with an oxide. For this purpose, high‐purity copper, thermally‐oxidized and sintered Cu2O and CuO samples are tribologically loaded and eventually formed wear particles analyzed. The tribological behavior of the oxides is found to be beneficial for a reduction of the coefficient of friction (COF), mainly due to an increase in hardness. The results reveal tribochemical reactions when copper oxides are present, irrespective of whether they form during sliding or are existent from the beginning. Most strikingly, a reduction of copper oxide to metallic copper is observed in X‐ray photoelectron spectroscopy measurements. A more accurate understanding of tribo‐oxidation will allow for manufacturing well‐defined surfaces with enhanced tribological properties. This paves the way for extending the lifetime of contacts evincing tribo‐oxidation.

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“…[11][12][13][14]. The microstructure of the copper layer produced by traditional casting processes show a coarse reticular dendritic structure, which leads to intergranular segregation and negative segregation, and hot-cracking in metal materials [15]; all of these defects severely restrict the tribological performances of materials. Numerous studies have reported that incorporating additives, such as graphite, molybdenum disulfide, titanium diboride, nickel, and silver powder, into the alloy matrix can improve the anti-wear and mechanical properties of the lubricating alloy [16][17][18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Effect of Two-Stage Cooling on the Microstructure and Tribological Properties of Steel–Copper Bimetals

et al. 2022

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In this paper, the solid–liquid composite method is used to prepare the steel–copper bimetal sample through two-stage cooling process (forced air cooling and oil cooling). The relationship between the different microstructures and friction properties of the bimetal copper layer is clarified. The results show that: the friction and wear parameters are 250 N, the speed is 1500 r/min (3.86 m/s), the friction coefficient fluctuates in the range of 0.06–0.1, and the lowest point is 0.06 at 700 °C. The microstructure of the copper layer was α-Cu, δ, Cu3P, and Pb phases, and Pb was free between α-Cu dendrites. When the solidification temperature is 900 °C, the secondary dendrite of α-Cu develops. With the decrease temperature, the growth of primary and secondary dendrites gradually tends to balance at 700 °C. During the wear process, Pb forms a self-lubricating film uniformly distributed on the surface of α-Cu, and the Cu3P and δ phases are distributed in the wear mark to increase α-Cu wear resistance.

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Development of highly wear resistant Cu - Al alloys processed via powder metallurgy

Cited by 50 publications

References 42 publications

The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

How Tribo‐Oxidation Alters the Tribological Properties of Copper and Its Oxides

Effect of Two-Stage Cooling on the Microstructure and Tribological Properties of Steel–Copper Bimetals

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