Development of Horizontal Elements in 3-D Microcontacts

Andreev, Svetozar; Videkov, Valentin; Arnaudov, R.; Avdjiiski, B.; Yordanov, N.

doi:10.1109/tepm.2006.872692

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Rf MCM With Qfn Package1

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2014

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“…2(b). 3D micro-contact elements pin-ring type [10] for the process of mounting of QFN carrier to the PCB are developed for assembly and disassembly of the carrier to the PCB (especially in testing), as shown in Fig. 2(c).…”

Section: Rf MCM With Qfn Packagementioning

confidence: 99%

Thermal Analysis of MCM Packaging

Andonova

2014

ElAEE

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This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radiofrequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented.

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Section: Rf MCM With Qfn Packagementioning

confidence: 99%

Thermal Analysis of MCM Packaging

Andonova

2014

ElAEE

View full text Add to dashboard Cite

show abstract

Development of Horizontal Elements in 3-D Microcontacts

Cited by 1 publication

References 5 publications

Thermal Analysis of MCM Packaging

Thermal Analysis of MCM Packaging

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