Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting

Kim, Sung-Il; Eungbo, Kim; So, Sang-kyun; Choi, Jiyeon; Joung, Yeun-Ho

doi:10.9718/jber.2016.37.5.168

Cited by 1 publication

(3 citation statements)

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“…A quartz material was selected due to its high chemical resistance and non-toxicity. The micro-inductor fabrication was conducted using MEMS processes such as sputtering, etching, photolithography, electroplating, bonding, and so on [10,11,12,18,19]. The detailed fabrication steps are described in Supplementary Material.…”

Section: Methodsmentioning

confidence: 99%

“…The size of the fabricated inductors was 2.2 mm (width) × 12 mm (length). The glass substrates were directly bonded by optical contact [19].…”

Section: Methodsmentioning

confidence: 99%

“…An implantable blood pressure sensor is inserted into blood vessels to directly monitor the blood vessel pressure over a long period of time, and the long-term data can be used for the evaluation of hypertension, heart failure, restenosis, and the efficacy of surgical interventions [4,10]. Over the past decades, implantable blood pressure sensors have been developed by various groups focusing on principles, materials, and fabrication processes [10,11,12,13,14,15,16,17,18,19]. Most blood pressure sensors use a micro-scale membrane that is deformed under external pressure.…”

Section: Introductionmentioning

confidence: 99%

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Characteristics of an Implantable Blood Pressure Sensor Packaged by Ultrafast Laser Microwelding

Kim

Park

et al. 2019

Sensors

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We propose a new packaging process for an implantable blood pressure sensor using ultrafast laser micro-welding. The sensor is a membrane type, passive device that uses the change in the capacitance caused by the membrane deformation due to applied pressure. Components of the sensor such as inductors and capacitors were fabricated on two glass (quartz) wafers and the two wafers were bonded into a single package. Conventional bonding methods such as adhesive bonding, thermal bonding, and anodic bonding require considerable effort and cost. Therefore CO2 laser cutting was used due to its fast and easy operation providing melting and bonding of the interface at the same time. However, a severe heat process leading to a large temperature gradient by rapid heating and quenching at the interface causes microcracks in brittle glass and results in low durability and production yield. In this paper, we introduce an ultrafast laser process for glass bonding because it can optimize the heat accumulation inside the glass by a short pulse width within a few picoseconds and a high pulse repetition rate. As a result, the ultrafast laser welding provides microscale bonding for glass pressure sensor packaging. The packaging process was performed with a minimized welding seam width of 100 μm with a minute. The minimized welding seam allows a drastic reduction of the sensor size, which is a significant benefit for implantable sensors. The fabricated pressure sensor was operated with resonance frequencies corresponding to applied pressures and there was no air leakage through the welded interface. In addition, in vitro cytotoxicity tests with the sensor showed that there was no elution of inner components and the ultrafast laser packaged sensor is non-toxic. The ultrafast laser welding provides a fast and robust glass chip packaging, which has advantages in hermeticity, bio-compatibility, and cost-effectiveness in the manufacturing of compact implantable sensors.

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