Development of Integrated Thermoelectric Sensors for Power Components

Bryan, Charlotte; Faucherand, Pascal; Escoffier, René; Plissonnier, M.; Savelli, G.

doi:10.1109/jsen.2021.3107772

IEEE Sensors J.

2023

DOI: 10.1109/jsen.2021.3107772

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Development of Integrated Thermoelectric Sensors for Power Components

Charlotte Bryan

Pascal Faucherand

René Escoffier

et al.

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2024

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Cited by 1 publication

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Thermistors and stacked thermopile on III-nitride LED wafer and their application for on-chip temperature measurement

Tong,

Yan,

Fang

2024

AIP Advances

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Temperature measurement of devices in working state is of critical importance. In this work, GaN-based thermistors and a thermopile are monolithically integrated with a III-nitride blue light-emitting diode (LED) for the on-chip temperature measurement of the LED. The thermistor is based on the temperature-dependent resistance, and the stacked thermopile is based on the Seebeck effect. The measured results indicate that both thermistors and the thermopile can monitor the temperature of the LED sensitively. Due to the advantages of higher sensitivity and easier signal processing, the thermopile is more suitable for real-time monitoring.

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Thermistors and stacked thermopile on III-nitride LED wafer and their application for on-chip temperature measurement

Tong,

Yan,

Fang

2024

AIP Advances

View full text Add to dashboard Cite

show abstract

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Development of Integrated Thermoelectric Sensors for Power Components

Cited by 1 publication

References 21 publications

Thermistors and stacked thermopile on III-nitride LED wafer and their application for on-chip temperature measurement

Thermistors and stacked thermopile on III-nitride LED wafer and their application for on-chip temperature measurement

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