Development of lead-free wave soldering process

Arra, Minna; Shangguan, Dongkai; Yi, Sammy; Thalhammer, Robert; Fockenberger, H.

doi:10.1109/tepm.2002.807731

Cited by 40 publications

(20 citation statements)

References 6 publications

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“…The tough Sn surface oxide layer of the Pb-free Sn-rich solders would cause serious problems for wave soldering. One of the most critical problems for wave soldering is the surface oxidation on the molten solder pot, which creates a "drossing" problem during the wave 1 The surface oxidation of the molten Sn-rich solder is also a concern for the soldering process of fl ip-chip and ball-grid array (BGA) solder joints. Although fl ux usually is applied during soldering, any remaining surface oxide on the wetting front of the spreading molten solder would cause poor wettability on the metal bond pad.…”

Section: Introductionmentioning

confidence: 99%

Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

Lee¹,

Tseng

Hsiao

et al. 2009

JOM

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Section: Introductionmentioning

confidence: 99%

Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

Lee¹,

Tseng

Hsiao

et al. 2009

JOM

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“…Characterizing solder materials according to whether or not they contain lead may influence the reliability of the solder joints. The optimized materials and process parameters were investigated by Arra et al (2002) experimentally by using DOE with three variables, namely: solder bath temperature, conveyor speed, and soldering atmosphere. Water-based flux was found to be the best system for successful lead-free wave soldering.…”

Section: Introductionmentioning

confidence: 99%

A computational fluid dynamics analysis of the wave soldering process

Aziz

Abdullah

Khor

et al. 2015

International Journal of Numerical Methods for Heat &Amp; Fluid Flow

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Purpose – The purpose of this paper is to present a three-dimensional finite volume-based analysis on the effects of propeller blades on fountain flow in a wave soldering process and performs an experimental validation. Design/methodology/approach – Solder pot models with various numbers of propeller blades were developed and meshed by using hybrid elements and simulated by using the FLUENT fluid flow solver. The characteristics of the fountain, such as flow profile, velocity vector, filling time, and fountain advancement, were investigated. Molten solder (Sn63Pb37) material, a temperature of 250°C, and a propeller speed of 830 rpm were applied in the simulation. The predicted results were validated by the experimental fountain profile. Findings – The use of a six-blade propeller in a solder pot increased the fountain thickness profile and reduced the filling time. Moreover, a six-blade propeller design resulted in a stable fountain profile and was considered the best choice for current wave soldering processes. Practical implications – This study provides a better understanding of the effects of propeller blades on the fountain flow in the wave soldering process. Originality/value – The study explores the fountain flow behavior and provides a reference to the engineers and designers in order to improve the fountain flow of the wave soldering.

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“…Generally the optimization of this process has been done through DoE (Design of Experiments), i.e. experimental testing procedures, and regression models [1,2,20]. The use of neural networks in wave solder process optimization [5] has been very rare and, on the whole, there are very few applications based on self-organizing maps (SOM) on process optimization in general [10,22].…”

Section: Introductionmentioning

confidence: 99%