Development of LTCC IR-Emitter and Its Packaging

Abstract

A thick film-based infrared (IR) source was fabricated using multilayer low-temperature co-fired ceramic (LTCC) technology. The proposed emitter was developed using screen printing of platinum material on LTCC substrates. The highly-uniform meander-shaped structure was fabricated with the size of 3.5 x 3.5 mm. Electrical, optical, and thermal characterization of the fabricated device were carried out. Device temperature reaches 600°C at 6.5 V. Optical characterization of the developed device shows that spectral range in the mid-IR region with power consumption of ~ 3 W. An in-house indigenised package was developed using glass metal seal technique for packaging of the developed IR source. Different windows viz., quartz, LiF, and CaF2 were used for packaging. The developed IR source demonstrated the potential to meet the performance, size, and cost requirements for various applications. The developed LTCC based IR source has planar and simple structure with high-temperature-stable lead-free interconnects.