Development of millimeter-wave devices based on liquid crystal polymer (LCP) substrate

Abstract

Millimeter-wave (mm-Wave) technology is a promising solution to meet ever-increasing demand in wireless data transmission capacity thanks to the availability of large bandwidths at mm-Wave frequencies, where the choice of dielectric materials is one of important issues because the high water absorption at mm-Wave frequencies restricts remarkably the choice. Liquid crystal polymer (LCP) is one of materials available for mm-Wave applications and is able to provide cost-effective solution. In this paper, features of LCP will be introduced for applications at V-band (60 GHz) and E-band (70 GHz, 80 GHz) in terms of dielectric constant, feasible structure, process and reliability. Some LCP-based devices such as transmission line, mode transition between different transmission-lines, antenna and filter will be reviewed. It is demonstrated that LCP-based devices actually have shown good performance and LCP is especially suitable for consumer applications that require high reliability and cost-effectiveness.

Implementation of High-Q Embedded Band Pass Filter in Wireless Communication

“…These features help make the technology more efficient and suitable for the design of filters [24]. Compared to conventional and narrowband filters, good rejection capacity and a compact size are achieved [25,26].…”

Characteristic Impedance Adjustment of Thin-Metal Mesh Transmission Lines for mmWave Display-Integrated Antennas

“…11 presents an equivalent transmission line model of the fabricated sample that is represented by five series segments of transmission lines with different Z0 and propagation constant . The characteristic impedances of the GCPWs are represented by Z0 (0) and Z0 (4) , and those of impedance transformers are denoted as Z0 (1) and Z0 (3) . The propagation constants and lengths of the five segments are given by i and li, respectively, for i = 0, 1, …, 4.…”

Si-based system-in-package design with broadband interconnection for E-band applications

“…To achieve both high-performance and low-profile, the 3-dimensional (3-D) system-in-package (SiP) has been an attractive and efficient approach to produce MMW wireless systems [7,8,9,10]. At present, low temperature co-fired ceramic (LTCC) [11,12,13,14,15], highdensity interconnect (HDI) [16,17,18,19,20], and embedded wafer level ball grid array (eWLB) [21,22,23,24,25] have all been demonstrated for mass production of MMW SiPs. However, the selection for MMW SiP is a tradeoff among compactness, cost, electrical performance and thermo-mechanical reliability [26].…”