Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

Rimdusit, Sarawut; Ishida, Hatsuo

doi:10.1016/s0032-3861(00)00164-6

Cited by 301 publications

(190 citation statements)

References 12 publications

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“…The phenolic hydroxyl groups of the ring opened the BA-a monomer then acted as an epoxy curing agent to open the epoxide ring to form the ether linkages in the copolymer networks as proposed in Figure 4b. These results are also in good agreement with the previous reports by our research group [30,36] and Kimura et al [31] using different types of epoxy resins.…”

Section: Fourier Transform Infrared Spectroscopy (Ftir) Of Ba-a/ngde supporting

confidence: 93%

“…The first reaction at the two overlapping exothermic peak at lower temperature is attributed to the polymerization reaction of the BA-a monomers, whereas the third exothermic peak at a higher temperature is the reaction between the phenolic hydroxyl group of the polybenzoxazine (PBA-a) and the epoxide group of the NGDE. This result is in good agreement with the curing behaviors of bisphenol-A based epoxy by the BA-a [29,36]. Figure 2 illustrates DSC thermograms at a heating rate 10°C/min of the NGDE/BA-a mixture at 50 mol% of the BA-a content at various curing conditions.…”

Section: Characterization Methodssupporting

confidence: 78%

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Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

Tanpitaksit¹,

Jubsilp²,

Rimdusit³

2015

Express Polym. Lett.

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Abstract. An ability of bisphenol-A/aniline based benzoxazine resin (BA-a) to simultaneously acts as a curing agent and a stable or rigid network segment for shape memory epoxy, i.e. a two component system, is demonstrated. This significantly simplifies a formulation of present shape memory epoxy systems, i.e. a three or four component system. A suitable content of BA-a in the aliphatic epoxy (NGDE)/polybenzoxazine (PBA-a) samples for good shape memory performance is in a range of 30 to 50 mol%. The storage modulus of the obtained NGDE/PBA-a shape memory polymers (SMPs) was increased from 3.57 GPa for 30 mol% BA-a content to 4.50 GPa for 50 mol% BA-a content. Glass transition temperature of the sample was also substantially increased with increasing BA-a fraction, i.e. from 51°C to 140°C. Flexural modulus and strength at room temperature of the samples at 50 mol% BA-a were found to be as high as 3.97 GPa and 132 MPa compared to the maximum values of 2.54 GPa and 100 MPa of SMP based on cyanate ester-epoxy. All samples exhibited a high value of shape fixity close to 100%. A presence of the BA-a in the samples also imparted a greater recovery stress ranging from 0.25 to 1.59 MPa. Consequently, the obtained NGDE/PBA-a copolymers are highly attractive for shape memory materials to be used in a broader range of applications particularly at elevated temperature and a higher recovery stress value.

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Section: Fourier Transform Infrared Spectroscopy (Ftir) Of Ba-a/ngde supporting

confidence: 93%

Section: Characterization Methodssupporting

confidence: 78%

Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

Tanpitaksit¹,

Jubsilp²,

Rimdusit³

2015

Express Polym. Lett.

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“…In this paper, we report on the synthesis of a bisphthalonitrile monomer containing benzoxazine and the properties of its polymer. Thermal polymerization of this monomer is relatively easy, because of the active benzoxazine ring in the backbone [8][9][10][11]. The focus of this research develops a novel bisphthalonitrile containing benzoxazine which expected that this bisphthalonitrile will contribute to the cross-link network formation by its own ring-forming polymerization.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of a novel bisphthalonitrile containing benzoxazine

Cao¹,

Chen²,

Wei³

et al. 2007

Express Polym. Lett.

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Abstract. The novel bisphthalonitrile containing benzoxazine (BPNBZ) has been synthesized using bisphenol-A, 4-aminophenoxylphthalonitrile and paraformaldehyde. The structure of the monomer was supported by FTIR spectroscopy, 1 H-NMR, and 13 C-NMR spectra, which have exhibited that the reactive benzoxazine ring and cyano groups exist in molecular structure of BPNBZ. The cure reaction of BPNBZ was monitored by the disappearance of the nitrile peak and the tri-substituted benzene ring that is attached with oxazine ring peak at 2231, 951 cm -1 . The thermal polymerization of the BPNBZ was studied by differential scanning calorimetry (DSC) and dynamic rheometer. It was shown that the bisphthalonitrile containing benzoxazine had completely cured with two-stage polymerization mechanisms according to oxazine ring-opening and phthalonitrile ring-forming. The thermal decomposition behaviors of the polymer were examined by thermogravimetry analysis (TGA) in nitrogen and in air. The materials achieve char yields above 73% under nitrogen at 800°C and above 78% under air at 600°C, which exhibited the cured resin has good thermal stability and thermo-oxidative stability.

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“…Now, they are widely applied as an interconnecting material for the connection between a chip or die and the substrate. [6][7][8][9][10][11] Conductive adhesives are also composed of conductive metal particles and a polymer matrix. 12,13) Conductive metal particles and the polymer matrix provide electrical and mechanical interconnections between the chip and the substrate.…”

Section: Introductionmentioning

confidence: 99%

Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive

et al. 2005

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This paper describes the effect of solvent evaporation and shrink in conductive adhesive. The adhesion mechanism of conductive adhesive strongly depends on the curing of the polymer matrix. The curing is preceded by polymer matrix chemical reactions, such as cross-linking, solvent evaporation and shrink. Accordingly, it is important to understand the effect of solvent evaporation and conductive adhesive shrink in curing. The curing behaviors and solvent evaporation of conductive adhesive were investigated using a differential scanning calorimeter (DSC) and thermo gravimetric analysis (TGA). As curing time increases, the silver particles in the polymer are concentrated due to the incremental solvent evaporation rate and the shrink rate. As a result, the silver particles in the polymer form an electric path. These results reveal that the shrink rate and solvent evaporation rate increase in conductive adhesive during the curing process improved their conductivity.

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Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

Cited by 301 publications

References 12 publications

Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

Synthesis and characterization of a novel bisphthalonitrile containing benzoxazine

Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive

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