Development of new concept thermoplastic temporary adhesive for 3D-IC integration

Kubo, Atsushi; Tamura, Koki; Imai, Hideyuki; Yoshioka, Taiyo; Ōya, Shigeo; Otaka, Shoji

doi:10.1109/ectc.2014.6897394

Cited by 15 publications

(5 citation statements)

References 6 publications

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“…To provide mechanical support, typical polymer layers include acrylics, thermoplastics, polyimides, and elastomers [203]. Nowadays, polymers that can resist temperatures of up to 250-300 • C are occupied in the market, and efforts are currently being made to produce materials that can tolerate even higher temperatures [204][205][206][207].…”

Section: Dielectric Bondingmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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Section: Dielectric Bondingmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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“…The laser release system has an advantage because of its low de-bonding temperature, low mechanical stress, and high throughput characteristics. [8][9][10][11] In addition, the broad process window of the laser release system is better for the FO-WLP application compared with the other conventional de-bonding systems.…”

Section: Laser Release Technologymentioning

confidence: 99%

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Mizuno¹,

Ishii²,

Kato³

et al. 2018

Transactions of The Japan Institute of Electronics Packaging

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Temporary bonding/de-bonding (TBDB) technology in a FOWLP process is required to adapt to a low temperature process because of the potential for damage in handling the thin molded compound embedding dies. We have developed laser releasable TBDB materials for low temperature bonding processes that enable UV laser release with high throughput and low thermal/mechanical stress. The developed TBDB materials consist of two layers, an adhesive layer and a release layer. The appropriate wafer bonding temperature can be controlled by the molecular weight of the polymer which is the main component of the adhesive material. Good bonding property has been seen, even at 160°C by adopting the lowest molecular weight polymer. On the other hand, the release layer material exhibits excellent stability that allows for fabrication of RDLs directly onto the layer to give a stacked structure in the Chip-last (RDL-first) method. The laser energies preferred for wafer release processes are 130 mJ/cm 2 for a 308 nm excimer laser and 190 mJ/cm 2 for a 355 nm YAG. These materials will be promising for advancements of FO-WLP applications.

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“…The first generation of temporary bonding materials was used for the thermal slide debonding process, such as Space Liquid from Nikka Seiko, HT series materials from Brewer Science [27][28][29][30][31], JSR [32], etc. ; as the application scenarios changed, materials and techniques for debonding using solvents (e.g., Zero Newton temporary debonding system from TOK [33,34]), mechanical forces (e.g., BrewerBOND ® 305) [35] or lasers (e.g., 3M WSS [36], HD-3007 from HDMS [23], BrewerBOND ® 701 [37][38][39]) to release were developed. Special technologies such as ZoneBOND ® [40] and air-jetting were developed [41,42].…”

Section: Introductionmentioning

confidence: 99%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Development of new concept thermoplastic temporary adhesive for 3D-IC integration

Cited by 15 publications

References 6 publications

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

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