Development of NIL processes for PV applications

Hauser, Hubert; Tucher, Nico; Tokai, K.; Schneider, Patrick E.; Wellens, Ch.; Volk, Anne-Kristin; Barke, Simon; Müller, Christoph Michael; Glinsner, T.; Bläsi, Bénédikt

doi:10.1117/12.2085754

Cited by 1 publication

(1 citation statement)

References 17 publications

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“…The miniaturization of components is one path to fulfill these requirements 1 . In addition, 3D patterns such as microlenses, blazed gratings and pyramids, have emerged as key elements with great potential to enhance device functionalities in microelectronics, photonics and optics 2,3 . However, 3D patterning requires complex, slow and expensive manufacturing approaches 1 .…”

Section: Introductionmentioning

confidence: 99%

Manufacturing of 3D submicronic structures at wafer scale

Fernandez Rodas,

Rêche,

Mendes

et al. 2024

Novel Patterning Technologies 2024

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3D patterns and miniaturization have emerged as key paths for novel applications in microelectronics, optics, photonics and more. However, the current manufacturing techniques for high-resolution 3D patterning are complex, slow, and expensive. Here, we combine grayscale electron-beam lithography (g-EBL) and nanoimprint lithography (NIL) to overcome these challenges. Indeed, g-EBL allows the fabrication of complex structures with high resolution, while NIL can replicate complex patterns down to the nanometer scale with reduced time and cost. In a first step, the master is fabricated by grayscale electron beam lithography to obtain high resolution. This "resist master" is employed to prevent possible pattern deformation caused by etching and stripping steps. In a second step, this master is replicated by NIL to increase the throughput. In addition, different characterizations are performed after each step in order to evaluate the process. The morphology, dimensions and material properties are studied.

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