Development of novel low temperature bonding technologies for microchip chemical analysis applications

Sayah, A.; Solignac, D.; Cueni, T.; Gijs, Martin A. M.

doi:10.1016/s0924-4247(99)00346-5

Cited by 54 publications

(40 citation statements)

References 13 publications

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“…The required bonding temperature of a glass microchip depends on the type of glass used, and can be varied from the mid 5007C to the low 6007C [31,32,34]. Low-temperature glass bonding technologies were also reported [73]. An alternative bonding process by gluing two substrates together by epoxy was recommended by several groups [74,75].…”

Section: Bonding Techniquesmentioning

confidence: 99%

New advances in microchip fabrication for electrochromatography

Szekeres

Guttman

2005

Electrophoresis

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There is a great demand in separation technologies for faster and more effective analysis processes. Miniaturization is a suitable technique for satisfying this demand as reduction in size gives increased separation speed with higher efficiency. CEC is an electric-field-mediated separation technique where the liquid flow is generated by the electric field itself. The main advantage of using electric field over pressure for flow generation is the flat flow profile of the EOF; thus, CEC is one of the best candidates to construct a novel and high-efficiency microanalytical device. The aim of the present paper is to review the basic fabrication and bonding principles, as well as connection and system integration options for microfluidics-based electrochromatography. The physical structure and fluidic channel formation are critically evaluated, including glass microstructuring and fusion bonding. Recent developments in nanoflow measurements and the application of various flow control units are also extensively discussed.

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Section: Bonding Techniquesmentioning

confidence: 99%

New advances in microchip fabrication for electrochromatography

Szekeres

Guttman

2005

Electrophoresis

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“…Other bonding processes involving PDMS or PDMS/glass devices are described in the literature as well [30,31]. In addition, many research groups have reported the bonding of glass microchips at room temperature without the requirements of cleanroom facilities [16,[32][33][34][35][36]. Such reported processes are strongly dependents of some factors as (i) multiple washing steps [32,33,35], (ii) need of an accurate holder to apply an equalized pressure between two glass plates [34] and (iii) still requiring instrumentation for sequential plasma activation of the glass surface [36].…”

Section: Introductionmentioning

confidence: 99%

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

et al. 2010

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In this report, we describe a rapid and reliable process to bond channels fabricated in glass substrates. Glass channels were fabricated by photolithography and wet chemical etching. The resulting channels were bonded against another glass plate containing a 50-microm thick PDMS layer. This same PDMS layer was also used to provide the electrical insulation of planar electrodes to carry out capacitively coupled contactless conductivity detection. The analytical performance of the proposed device was shown by using both LIF and capacitively coupled contactless conductivity detection systems. Efficiency around 47,000 plates/m was achieved with good chip-to-chip repeatability and satisfactory long-term stability of EOF. The RSD for the EOF measured in three different devices was ca. 7%. For a chip-to-chip comparison, the RSD values for migration time, electrophoretic current and peak area were below 10%. With the proposed approach, a single chip can be fabricated in less than 30 min including patterning, etching and sealing steps. This fabrication process is faster and easier than the thermal bonding process. Besides, the proposed method does not require high temperatures and provides excellent day-to-day and device-to-device repeatability.

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“…A Photolithographic process followed by a HF etching step was used to create a channel on the chip, as described in detail elsewhere [11]. Brie¯y, the pyrex wafer was coated with a chromium layer (50 nm), a gold layer (200 nm) and the photoresist.…”

Section: Microchipsmentioning

confidence: 99%

Utilization of the sol–gel technique for the development of novel stationary phases for capillary electrochromatography on a chip

Constantin

Freitag

Solignac

et al. 2001

Sensors and Actuators B: Chemical

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Capillary electrochromatography (CEC) appears ideally suited for high performance separations at small scale, i.e. on a chip. Problems with the reproducible production of the required m-HPLC column, but also the lack of commercially available m-CEC instruments have prevented many putative applicants of this promising technique from entering the ®eld. In this paper, a fast and easy way to produce selfcontaining open-tubular m-CEC columns (C 8 -moieties for reversed phase applications) by the sol±gel technique is described. The corresponding chips were designed to be compatible with a commercial system for capillary electrophoresis (namely a Beckman P/ACE 5500 system with diode array detection). Method development and application hence bene®ted from the injection and the detection options of this setup. The separation of a mixture of three uncharged analytes (polycyclic aromatic hydrocarbons) by the chip is given as example. Under optimized conditions, the performance of the chip appeared to be comparable or better than that of capillary-based CEC columns of the same kind. #

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Development of novel low temperature bonding technologies for microchip chemical analysis applications

Cited by 54 publications

References 13 publications

New advances in microchip fabrication for electrochromatography

New advances in microchip fabrication for electrochromatography

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

Utilization of the sol–gel technique for the development of novel stationary phases for capillary electrochromatography on a chip

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