“…Thermosetting resins, such as phenolic resins, epoxides, bismaleimides, cyanates, vinyl esters, and polyimides, are high-performance polymers with a wide range of applications in aerospace, structural, adhesives, electronics, and coatings fields. In recent years, polybenzoxazine resins have gained immense attention in academia and industry, because they combine the thermal and mechanical strength of phenolic resins with much wider molecular design flexibility and overcome several disadvantages of traditional phenolic resins [1,2,3,4,5,6,7,8,9,10,11,12]. These resins have a number of excellent properties such as high carbon yield, low water absorption, high mechanical strength, high glass transition temperature ( T g ), very low shrinkage, and no byproduct formation during the curing process.…”