Development of processes for preparation and use of solder alloys in a dispersed state with a microcrystalline or amorphous structure

Pashkov, I. N.; Пикунов, М. В.; Tavolzhanskii, S. A.; Pashkov, A. I.

doi:10.1007/s11015-010-9303-4

Cited by 7 publications

(4 citation statements)

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“…The ultrarapid quenching enables obtaining solder in the shape of foils, which is convenient to use for certain types of soldering, for example, in automated processes. The foils obtained by the ultrarapid quenching are expected to have a more homogeneous structure with dispersed precipitates of phases and grains, which increases the quality of the material [17]. There is a very limited amount of studies available on solders obtained by the ultrarapid liquid quenching, and these are focused on high-temperature soldering alloys [18,19].…”

Section: Introductionmentioning

confidence: 99%

“…The foils obtained by the ultrarapid quenching are expected to have a more homogeneous structure with dispersed precipitates of phases and grains, which increases the quality of the material [17]. There is a very limited amount of studies available on solders obtained by the ultrarapid liquid quenching, and these are focused on high-temperature soldering alloys [18,19]. Hence, it is important to fabricate and study the microstructure of ultrarapidly quenched eutectic foils of zinc-doped indium-tin system in order to evaluate their potential for high-performance lowtemperature solders, their suitability for mass production and their use in the automation of the soldering process.…”

Section: Introductionmentioning

confidence: 99%

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Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

et al. 2018

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Alloys with the composition of Sn (46.5 at.%)-In (50.7 at.%)-Zn (2.8 at.%) were fabricated by using the ultrarapid quenching process, with quenching rate up to 10 5 K/s. These materials were obtained in the shape of foils with a thickness varying from 30 to 70 lm. Their phase composition, microstructure, grain structure, and texture have been analyzed and revealed that these alloys consist of solid solutions based on the b phase (In 3 Sn) and c phase (InSn 4) with inclusions of zinc. Aging processes in the foils revealed that the volume fraction of zinc (V Zn) increases with the increase in the samples exposure time to the air at room temperature. The electron backscatter diffraction analysis has shown that these foils have a microcrystalline structure. The mechanism of the texture formation in these materials has been explained.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

et al. 2018

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“…Since the formation of clusters occurs randomly throughout the entire volume of the supercooled and supersaturated liquid solution, this causes uniform distribution of the crystalline phases in the rapidly cooled alloy. The uniformity of the phase distribution in foils is of great practical importance, for example, in the manufacturing of solders [14], as well as elements of various technical devices.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Microhardness of Rapidly Cooled Bi–38 wt % Sn, Additionally Doped with Lead

Shepelevich

2018

J. Synch. Investig.

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“…2). Образование дисперсной и микрокристаллической структуры в фольге сплавов системы свинец-олово способствует увеличению эффективности ее использования в качестве припоя [12]. Зависимость удельной поверхности межфазных границ быстроохлажденной фольги от состава представлена на рис.…”

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Influence of decomposition of oversatured liquid solutions on the structure and microhardness of quickly curing alloys of the Pb–Sn system

Shepelevich

Belaya

Neumerzhytskaya

2020

Vescì Akademìì navuk Belarusì. Seryâ fizika-tehničnyh navuk

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The results of studies of the structure and microhardness of foil alloys of the lead–tin system obtained by high-speed cooling from the liquid phase are presented. The foil sample had the following dimensions: length – up to 10 cm, width – up to 1 cm, and thickness – 30–80 microns. Melt cooling rate was not less than 105 K/s. A rapidly cooled foil is chara cterized by a dispersed structure. The size of the discharge of tin and lead does not exceed 5 μm. The specific surface of the interfacial boundaries achieve 1.7 μm–1. Due to supercooling, a microcrystalline structure forms in the foil. The average lengths of chords of random secants on lead and tin grain sections in the Pb–73 at.% Sn alloy foil are 0.8 and 1.8 μm respectively. The texture of (111) lead and (100) tin is formed in the foil of alloys of the lead – tin system under certain conditions. The formation of the structure of lead alloys containing from 20 to 95 at.% tin is due to the occurrence of spinodal decomposition of a supersaturated liquid solution, and, in other alloys, due to decay by the mechanism of formation and growth of nuclei of crystalline phases. The stratification of the liquid solution leads to the formation of areas enriched in lead and tin, which contribute to the formation of crystallization centers that are equally distributed in the volume of the foil. The microhardness of the foil alloys, whose compositions are close to eutectic, is less than the microhardness of massive alloys of the same composition, which is associated with the softening effect of grain boundaries and interphase boundaries. Exposure of these alloys at room temperature causes an increase in microhardness due to a decrease in slippage at the boundaries. The decomposition of supersaturated solid solutions of Pb–5 at.% Sn and Sn–1 at.% Pb alloys leads to a decrease in microhardness due to the weakening of the effect of the solid solution hardening mechanism. The results of the study can be used to create fusible solders, bearing alloys, alloys for cable sheaths with improved physicochemical properties.

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Development of processes for preparation and use of solder alloys in a dispersed state with a microcrystalline or amorphous structure

Cited by 7 publications

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Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

Microstructure and Microhardness of Rapidly Cooled Bi–38 wt % Sn, Additionally Doped with Lead

Influence of decomposition of oversatured liquid solutions on the structure and microhardness of quickly curing alloys of the Pb–Sn system

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