2004
DOI: 10.1016/j.jnucmat.2004.04.170
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Development of rapidly quenched brazing foils to join tungsten alloys with ferritic steel

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Cited by 41 publications
(29 citation statements)
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“…The presence of these residual stresses is widely known and has been discussed in detail in previous research [2,11]. These residual stresses cannot be eliminated by stress relief due to the dissimilar materials used.…”
Section: Residual Stresses Due To Joint Manufacturementioning
confidence: 98%
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“…The presence of these residual stresses is widely known and has been discussed in detail in previous research [2,11]. These residual stresses cannot be eliminated by stress relief due to the dissimilar materials used.…”
Section: Residual Stresses Due To Joint Manufacturementioning
confidence: 98%
“…A fracture mechanics based approach has been developed by Seki [14] to estimate the fatigue crack propagation life of small defects in a brazed layer, however, this does not consider the scenario where cracks initiate in the parent materials where it is known to occur [2,15]. You [6] proposed using the approach detailed in ASME III [17] to predict life of either of the parent materials and Carter [18] detailed a method for predicting fatigue lives of brazed joints in heat exchangers.…”
Section: Previous Work On the Modelling And Fatigue Of Dissimilar Bramentioning
confidence: 99%
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“…: +86-0511-84401184; fax: +86-0511-84407381; e-mail address: xczsdu@gmail.com ing mechanical properties of the brazed joint of W-Cu and stainless steel. Now considerable interest has been generated in brazing of W metal and W-Cu composite with amorphous filler metals [7][8][9][10][11][12]. Researchers from the Moscow Institute of Engineering and Physics have researched the bonding mechanism of dissimilar materials in brazing W alloy and steel with amorphous filler metals of Ni-based, Ti-based and Fe-based [13].…”
Section: Introductionmentioning
confidence: 99%
“…The suitable brazing materials result in brittle brazing layers and thus a joint with a very low toughness [4]. In addition, they need a process temperature usually much higher than the recrystallisation temperature of the materials to be joined [4,5]. To avoid a substantial change in the microstructure and properties of the materials to be joined, the solid state diffusion bonding is considered.…”
Section: Introductionmentioning
confidence: 99%