1956
DOI: 10.1111/j.1151-2916.1956.tb15595.x
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Development of Safe Cooling Schedules for Structural Clay Products

Abstract: emphasize the importance of the surface behavior in its relation to strength. Below firing temperatures of G O o , t h e chemically treated clays were generally weaker than the untreated clay, whereas at higher temperatures they were generally stronger. The NaC1-treated clay fired to temperatures below 50O0 was stronger than the CaC12-treated clay, which was in turn stronger than the HC1-treated clay. These results agree with those cited in t h e literaturezv7 (i.e., the dry strength decreases with the adsorbe… Show more

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Cited by 6 publications
(2 citation statements)
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“…Furthermore, these cracks also reduce the Young modulus, as has already been verified in materials with much lower porosity and abundant glassy phase (porcelain, sanitary ware). 36,37 In order to analyse the effect of microcracking and total porosity, ε, on Young's modulus, it was assumed that the elastic modulus of the porous body without microcracks, E , is directly proportional to the solid area, also known as the Minimum Solid Area (MSA). 38 These models predict, for a broad range of porosity, a familiar exponential relationship of the form:…”
Section: Mechanical Propertiesmentioning
confidence: 99%
“…Furthermore, these cracks also reduce the Young modulus, as has already been verified in materials with much lower porosity and abundant glassy phase (porcelain, sanitary ware). 36,37 In order to analyse the effect of microcracking and total porosity, ε, on Young's modulus, it was assumed that the elastic modulus of the porous body without microcracks, E , is directly proportional to the solid area, also known as the Minimum Solid Area (MSA). 38 These models predict, for a broad range of porosity, a familiar exponential relationship of the form:…”
Section: Mechanical Propertiesmentioning
confidence: 99%
“…It is reasonable to think that viscous flow is present [21], thus some "necks", or solid bonds, are expected to form. This may explain why the Young's modulus increases on cooling after the second and third thermal cycles.…”
Section: Microstructure and Thermal Mechanical Behaviormentioning
confidence: 99%