Development of substrate-free frequency-scaled ultra-wide spectrum element (FUSE) phased array

Elsallal, M. Wajih; Hood, Jamie R.; Kindt, Rick W.

doi:10.1109/array.2016.7832631

Cited by 22 publications

(6 citation statements)

References 7 publications

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“…Complex geometries of wideband phased array and metamaterial designs were studied for 3D-printed PLA composites with conductive inks at room temperature [144]. The dielectric constant and loss tangent of PLA were found to be stable up to 18 GHz.…”

Section: Electromagnetic Applicationsmentioning

confidence: 99%

Extrusion-Based 3D Printing Applications of PLA Composites: A Review

2021

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Polylactic acid (PLA) is the most widely used raw material in extrusion-based three-dimensional (3D) printing (fused deposition modeling, FDM approach) in many areas since it is biodegradable and environmentally friendly, however its utilization is limited due to some of its disadvantages such as mechanical weakness, water solubility rate, etc. FDM is a simple and more cost-effective fabrication process compared to other 3D printing techniques. Unfortunately, there are deficiencies of the FDM approach, such as mechanical weakness of the FDM parts compared to the parts produced by the conventional injection and compression molding methods. Preparation of PLA composites with suitable additives is the most useful technique to improve the properties of the 3D-printed PLA parts obtained by the FDM method. In the last decade, newly developed PLA composites find large usage areas both in academic and industrial circles. This review focuses on the chemistry and properties of pure PLA and also the preparation methods of the PLA composites which will be used as a raw material in 3D printers. The main drawbacks of the pure PLA filaments and the necessity for the preparation of PLA composites which will be employed in the FDM-based 3D printing applications is also discussed in the first part. The current methods to obtain PLA composites as raw materials to be used as filaments in the extrusion-based 3D printing are given in the second part. The applications of the novel PLA composites by utilizing the FDM-based 3D printing technology in the fields of biomedical, tissue engineering, human bone repair, antibacterial, bioprinting, electrical conductivity, electromagnetic, sensor, battery, automotive, aviation, four-dimensional (4D) printing, smart textile, environmental, and luminescence applications are presented and critically discussed in the third part of this review.

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Section: Electromagnetic Applicationsmentioning

confidence: 99%

Extrusion-Based 3D Printing Applications of PLA Composites: A Review

2021

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“…As modern electronics are designed with the emphasis to improve compactness, agility, thermal stability, and device performance, dielectric materials have become an imperative area of research. For instance, dielectric materials are utilized in interconnect technologies to reduce signal delay, noise, and power consumption and facilitate the propagation velocity of electromagnetic waves. − Additive manufacturing or three-dimensional (3D) printing has accelerated the exploration of previously unattainable functionalities of electronics by broadening geometrical construction designs with customizable building materials. , However, many of the exploration were limited to the constructions with conventional 3D printable materials − owing to the lack of 3D printable dielectrics with simultaneous offering of (i) low loss, (ii) low relative permittivity, and (iii) high thermal stability that is compatible with metals through various heat treatments. , …”

Section: Introductionmentioning

confidence: 99%

Additive-Manufactured Stochastic Polyimide Foams for Low Relative Permittivity, Lightweight Electronic Architectures

Liu

Auguste

Hardin

et al. 2021

ACS Appl. Mater. Interfaces

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Polyimides are widely utilized engineering polymers due to their excellent balance of mechanical, dielectric, and thermal properties. However, the manufacturing of polyimides into complex multifunctional designs can be hindered by dimensional shrinkage of the polymer upon imidization and post processing methods and inability to tailor electronic or mechanical properties. In this work, we developed methods to three-dimensional (3D) direct ink write polyimide closed-cell stochastic foams with tunable densities. These polyimide structures preserve the geometrical fidelity of 3D design with a linear shrinkage value of <10% and displayed microscale porosity ranging from 25 to 35%. This unique balance of morphology and direct-write compatibility was enabled by polymer phase inversion behavior without the need of conventional post-print cross-linking, imidization, or poreinducing freeze processing. The manufacturability, thermal stability, and dielectric properties of the 3D polyimide stochastic foams reported here serve as enablers for the exploration of hierarchical, lightweight, high-temperature, high-power electronics.

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“…These baluns are capable of suppressing common-modes across a wide bandwidth while concurrently performing a 4:1 impedance transformation. Other types of wideband arrays are the Frequency-Scaled Ultra-wide Spectrum Elements (FUSE) and employ carefully placed shorting pins and H-Walls [7]. Recently, Wide Angle Impedance Matching (WAIM) layers were introduced with TCDAs for greater bandwidth while scanning [8], [9].…”

Section: Introductionmentioning

confidence: 99%