Development of super fine pattern PWB MOSAIC

Abstract

Current electronics products, especially like digital mobile products to which people are paying attention now, require high speed data transfer rate for moving picture transformation, large memory size as well as light weight for portability. To meet those demands, PWB is also required to have shortest paths, high pin count IC compatibility and light weight. Based on those demands, variety of build up and/or multi layer PWBs are proposed and available in a market. In any case, key points are fine patteming, small via hole connection and surface mount compatibility. In these trends, previously, we have developed 2 layer flexible crcuit, without adhesive layer, called Hyper Flexm. This epoch-making Hyper FlexTM is capable of becoming thinner thickness and having narrower lines compared to conventional flexible circuit with adhesion. It also made it possible to have land on both sides on base material and cover coat by combining wet etching technology at polyamic acid state. Using this high density print wiring board, we have developed unique and simple build up PWB, MOSAIC(Multip1e Organic Accumulated Inter Connection) series.