“…However, anchoring the semiconductor to a surface (e.g., thin films, coatings) can solve these problems. The semiconductors can be deposited as thin films by various methods, namely: (i) physical (e.g., pulsed-laser deposition [ 9 ], sputtering [ 10 ], reactive evaporation [ 11 ], thermal evaporation [ 12 ] and, atomic layer deposition [ 13 ], ultrasonic and microwave-assisted methods [ 14 ]); (ii) chemical (e.g., electrochemical [ 15 ], chemical vapor deposition [ 16 ], SILAR technique [ 17 ], chemical bath deposition (CBD) [ 18 ], and sol-gel method [ 19 ]).…”