2007
DOI: 10.1016/j.physc.2007.04.257
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Development of textured substrates with low magnetism

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Cited by 11 publications
(3 citation statements)
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“…Meanwhile, highly textured Ni-7.5 at.%W and Ni-9 at.%W substrates were successfully prepared recently by our group using distinct heat treatments during preparation for homogenization and stress relief [8,9]. Only a few other reports on highly textured substrates with higher W contents have been published [10,11]. It should be mentioned at this place, that an alternative approach to strengthen the substrate and to reduce the ferromagnetic Curie temperature is the use of a composite structure with a stronger non-ferromagnetic core material and a shell material, which exhibits a high texture quality [12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…Meanwhile, highly textured Ni-7.5 at.%W and Ni-9 at.%W substrates were successfully prepared recently by our group using distinct heat treatments during preparation for homogenization and stress relief [8,9]. Only a few other reports on highly textured substrates with higher W contents have been published [10,11]. It should be mentioned at this place, that an alternative approach to strengthen the substrate and to reduce the ferromagnetic Curie temperature is the use of a composite structure with a stronger non-ferromagnetic core material and a shell material, which exhibits a high texture quality [12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…It was found that the alloy with composition Ni-2 at.% W-10 at.% Cr is paramagnetic at 77 K. But the presence of large fraction of Cr leads to formation of Cr oxides on the tape surface that causes the local irregularities and damages in the microstructure of buffer layers applied whereas the alloys of Ni-W exhibit much better resistance to oxidation [7]. Standard Ni-W alloy with W content 5 at.% (Ni-5W) have T c = 365 K and M sat = 25 emu/g (4.2 K) [8].…”
Section: Introductionmentioning
confidence: 99%
“…The presence of a soft magnetic underlayer may reduce the overall coercivity and remanence significantly, if a SmCo 5 layer is deposited on the Ni underlayer. The Curie temperature of Ni can be reduced below room temperature by doping W with a concentration of approximately 9 at% or higher [19]. The fcc-Ni based Ni-W solid solution may be a good candidate.…”
Section: Introductionmentioning
confidence: 99%