Development of the new thermal inkjet head on SOI wafer

Bae, Ki Deok; Baek, Seog Soon; Lim, Hyung-Taek; Kuk, Keon; Ro, K.

doi:10.1016/j.mee.2005.01.020

Cited by 11 publications

(7 citation statements)

References 2 publications

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“…Park and Oh [10] presented a thermally driven monolithic inkjet print head comprising dome-shaped ink chambers, thin film nozzle guides and heaters integrated on the top surface of each chamber. Bae et al [11] proposed a TIJ printer head on a SOI wafer that comprised two rectangular heaters. Baek et al [12] proposed a novel high-density TIJ to overcome defects due to the limitations of the nozzle density in conventional TIJs.…”

Section: Introductionmentioning

confidence: 99%

Droplet ejection performance of a monolithic thermal inkjet print head

Sen¹,

Darabi²

2007

J. Micromech. Microeng.

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This paper presents a simulation study of the droplet ejection performance of a thermal inkjet print head. The geometry of the print head comprises a dome-shaped ink chamber, a nozzle guide and a ring-shaped heater integrated on each chamber. The design eliminates direct contact between the heater and the ink, thus minimizing heater burnout. The ink manifold, ink chamber and nozzle are aligned, thus facilitating higher nozzle density. The model simulates thermal bubble dynamics including nucleation and growth of thermal bubbles caused by a thermal pulse. The model was validated by comparing model predictions with experimental results for a previously reported print head design. Then, the model was used to simulate the droplet ejection performance of the proposed inkjet print head. Effects of print head geometry including nozzle diameter, nozzle length, chamber size, heater dimensions and location, thermal conductivity of the passivation layer, operating conditions including total thermal energy and pulse width, properties of the ink including density, viscosity and surface tension on the performance of the inkjet device are investigated. The influence of these parameters on the drop volume and velocity, threshold energy and tail length of the ejected droplets is studied.

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Section: Introductionmentioning

confidence: 99%

Droplet ejection performance of a monolithic thermal inkjet print head

Sen¹,

Darabi²

2007

J. Micromech. Microeng.

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“…27 Once the resistive element is heated (300 • C) the fluid ink begins to bubble, eventually releasing a droplet that flows from the restrictor into the chamber of the print head. Such high resolution (300 dpi) inkjet print heads have been optimized to print a range of colored inks by sequestering each color from others in the cartridge.…”

Section: Inkjet Printing Of Biomoleculesmentioning

confidence: 99%

Printing Bioinks with Technologically Relevant Applications

Deravi

Wright

Sumerel

2009

The Chemistry of Inkjet Inks

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“…At present, micro-electro-mechanical systems (MEMS) technology has become the mainstream method of inkjet printhead manufacturing [ 14 ]. It is based on photolithography, deposition, epitaxy, doping, etching, packaging, bonding, and other two-dimensional or three-dimensional processing methods as the basic process steps to manufacture complex three-dimensional devices [ 15 , 16 ]. The process of fabricating chambers is becoming more important for the inkjet printhead.…”

Section: Introductionmentioning

confidence: 99%

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Huang

Tang²,

Liu

et al. 2022

Micromachines

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The process of fabricating chambers is becoming more important for inkjet printheads. However, there are some problems with the majority of present fabrication methods, such as nozzle structural deformation, blocked chambers, and collapsed chambers. In this paper, we propose a new process for preparing printhead chips by bonding tantalum nitride thin-film heaters and SU-8 chamber film using UV curing optical adhesive. This process simplifies the preparation process of printhead chips and overcomes the limitations of the traditional adhesive bonding process. Firstly, a chamber film was prepared by the molding lithography process based on a PDMS mold. The chamber film was then bonded with the membrane heater by the adhesive bonding process based on film transfer to form a thermal bubble printhead chip. Finally, the chip was integrated with other components to form a thermal inkjet printhead. The results show that the overflow width of bonding interface of 3.10 μm and bonding strength of 3.3 MPa were achieved. In addition, the printhead could stably eject polyvinyl pyrrolidone binder droplets, which are expected to be used for binder-jetting printing of powder such as ceramics, metals, and sand molds. These results might provide new clues to better understand the adhesive bonding process based on film transfer and the new applications of inkjet printheads.

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Development of the new thermal inkjet head on SOI wafer

Cited by 11 publications

References 2 publications

Droplet ejection performance of a monolithic thermal inkjet print head

Droplet ejection performance of a monolithic thermal inkjet print head

Printing Bioinks with Technologically Relevant Applications

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

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