Development of wafer scale encapsulation process for large displacement piezoresistive MEMS devices

High-sensitivity tunneling magneto-resistive micro-gyroscope with immunity to external magnetic interference

“…To improve the performance of the MEMS gyroscopes, lots of researches have been done on the weak Coriolis force detection method of the MEMS gyroscopes. Most of the MEMS gyroscopes have been realized by the capacitance 10 – 13 , piezoelectric 2 , 14 – 16 and piezo-resistive methods 17 , 18 . The capacitance detection method is vulnerable to electromagnetic interference 10 , and limited detection sensitivity has been the major issue to enhance the sensitivity of MEMS gyroscopes.…”

“…Due to the bias stability and correction speed, the piezoelectric method is not suitable for continuous testing 14 , 15 . Moreover, it is difficult to improve the sensitivity of piezo-resistive-based MEMS gyroscopes because of their inherent temperature effect 17 .…”

“…Comparison of the characteristics and performance of the gyroscopes based on different mechanisms.Good robustness, wide measuring range, and high resistance to shock Work in atmospheric environment, need correction to compensate the temperature-induced drift Sensitivity: 4.5 mV/º/s 2 Angle random walk: 0.05°/√h Piezoresistive17,18 Detection accuracy limited by temperature effect Sensitivity: 1.48 Ω/rad/s18 Noise floor: mdps/√Hz18 …”

Synthesis of an adhesion-enhancing polyhydrosiloxane containing acrylate groups and its cross-linked addition-cure silicone encapsulant

“…1 Currently, there are some kinds of electronic encapsulants, such as epoxy, 2 polycarbonate, 3 polyurethane, 4 polyethylene, 5 and silicone materials. [6][7][8] Among them, additioncure silicone encapsulant (ASE) has attracted more and more attention in the field of aerospace, automotive, and electronic devices because of its wide service temperature range, low shrinkage, excellent electrical properties, good thermal stability, excellent resistance to water, chemicals, ultraviolet radiation and weather, and no toxicity.…”

“…In the electronics industry, in order to strengthen the integrity of the electronic devices, improve the stability of the component parameters, and prolong the service life of the electronic devices, it is often necessary to encapsulate the delicate electronic components to provide protection from moisture, corrosive agents, ultraviolet radiation, mechanical vibrations, and thermal shocks. 1 Currently, there are some kinds of electronic encapsulants, such as epoxy, 2 polycarbonate, 3 polyurethane, 4 polyethylene, 5 and silicone materials. [6][7][8] Among them, additioncure silicone encapsulant (ASE) has attracted more and more attention in the field of aerospace, automotive, and electronic devices because of its wide service temperature range, low shrinkage, excellent electrical properties, good thermal stability, excellent resistance to water, chemicals, ultraviolet radiation and weather, and no toxicity.…”