Development status of thick film photoresist for semiconductor packaging

Misumi, Koichi; Sumii, Koji; Obiya, Hiroyuki

doi:10.1117/12.600257

Cited by 2 publications

(2 citation statements)

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“…In a typical setting, the laminator roll pressure ranges from 3 to 5 bars, too high to apply to a fragile and delicate substrate. In addition, many commercially available dry PR films are in a negative tone, and the development of a positive-tone type film is an active research area [27].…”

Section: Journal Of Micromechanics and Microengineeringmentioning

confidence: 99%

Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates

Zhang¹,

Han²,

Zhu³

et al. 2014

J. Micromech. Microeng.

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Dry film photoresists (DF PRs) are widely used to perform photolithography on nontraditional substrates such as printing circuit boards, plastic sheets, or non-planar surfaces. Commercially available DF PRs are usually in a negative tone and rather thick, limiting lithographic resolution and versatility. The relatively large pressure required for lamination also prevents the technology from being used for delicate substrates. Here we present a modified soft-lithographic process, namely photoresist blanket transfer (PR BT), transferring a spin-coated PR film from a flat elastomeric stamp to a substrate. The elastomeric stamp is highly compliant, bringing the PR film into intimate contact with the substrate and eliminating the need for a large lamination pressure. Photolithography on unconventional substrates such as etched, fragile, and porous ones is demonstrated. Single or multiple transfers of PRs by BT are utilized to fabricate multilayer, free-standing, and re-entrant polymeric microstructures. A fragile and porous substrate such as an anodized aluminum oxide membrane can also be patterned using PR BT. Moreover, a reliable method to create metal electrodes and high surface area catalysts inside microchannels is discussed for novel microfluidic applications.

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Section: Journal Of Micromechanics and Microengineeringmentioning

confidence: 99%

Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates

Zhang¹,

Han²,

Zhu³

et al. 2014

J. Micromech. Microeng.

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“…The improvements associated with the release of PC-0059B come under three categories: non-interaction with copper, improved photospeed, and resistance to damage or defects during the plating process [6]. However, of the three areas list above, the ability of PC-0059B to perform well in direct contact with the underlying copper substrate is by far the most notable.…”

Section: Introductionmentioning

confidence: 99%

Characterization of a high-photospeed positive thick photoresist for lead-free solder electroplating

Flack¹,

Nguyen²,

Washio³

et al. 2007

Proceedings of SPIE

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The introduction of lead free solder (SnAg) electroplating for advanced packaging applications has created new challenges for thick photoresist processes. Dry film laminate photoresist materials do not provide sufficient resolution or process control for the smaller bump diameters used with advanced design rules. The traditional positive tone DNQ-Novolak photoresists require large exposure doses and long processing times that are unacceptable for the total cost of ownership (COO) of the lithography cell in a manufacturing environment. Standard chemically amplified positive photoresists have interactions between the PAG and Cu or Cu 2 O at the soft bake step which makes it impossible to obtain sufficient pattern fidelity for electroplating lead free solder on copper seed layer substrates. This study will characterize a novel positive tone, chemically amplified photoresist (TOK PC-0059B PM) that can be double coated up to 100 μm thick for lead free solder electroplating. The PAG in the photoresist has been formulated to prevent any interaction with Cu or Cu 2 O. This photoresist exhibits extremely high photospeed, excellent pattern resolution and ease of stripability after electroplating. The lithographic performance of the thick positive photoresist will be optimized on 300mm wafers using a broad band, low numerical stepper. Enhanced process latitude and very high photospeeds will be demonstrated for thicknesses up to 100 μm. Cross sectional SEM analysis, process linearity, and electroplating performance are used to establish the lithographic capabilities.

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Development status of thick film photoresist for semiconductor packaging

Cited by 2 publications

References 0 publications

Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates

Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates

Characterization of a high-photospeed positive thick photoresist for lead-free solder electroplating

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