Abstract:The toxic and reactive nature of the materials utilized during ion implantation generates safety and environmental challenges. Recent introduction of reduced-pressure gas sources alleviated many concerns associated with delivering dopant species into the tool. However, materials not implanted onto wafers are instantly exhausted from the tool through roughing pumps or accumulated and later discharged using cryo pumps. Both pumps contribute ballast or carrier gas flows (typically nitrogen) resulting in tool effl… Show more
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