Developnent of solder bump fabrication in multicalp modules

Abstract

Recently, u n y n e w kinds o f high-density bonding tecniques have been developed [1],[2]. kong these i s the solder b w p f a b r i c a t i o n techniques f o r use i n u n u f a c t u r l n g high-density ICs and Mu1 t i c h i p Modules.