2007 IEEE International Conference on Microelectronic Test Structures 2007
DOI: 10.1109/icmts.2007.374472
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Device Array Scribe Characterization Vehicle Test Chip for Ultra Fast Product Wafer Variability Monitoring

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Cited by 18 publications
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“…Multiple test structures were measured per each die, and all dies were tested for increased statistics and wafer failure maps. The test was executed on a proprietary parallel tester [6].…”
Section: Resultsmentioning
confidence: 99%
“…Multiple test structures were measured per each die, and all dies were tested for increased statistics and wafer failure maps. The test was executed on a proprietary parallel tester [6].…”
Section: Resultsmentioning
confidence: 99%