2018 XIV-th International Conference on Perspective Technologies and Methods in MEMS Design (MEMSTECH) 2018
DOI: 10.1109/memstech.2018.8365703
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DFT simulation of stacking faults defects in 4H-SiC

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Cited by 2 publications
(4 citation statements)
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“…The largest difference was found for the 4H-SiC_3SSF structure. The results reported here agree very well with our previous simulations [ 27 ], where MedeA VASP with the DFT framework and Meta-GGA with MBJLDA functionals were used.…”
Section: Density Of States For 4h-sic With Defectssupporting
confidence: 91%
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“…The largest difference was found for the 4H-SiC_3SSF structure. The results reported here agree very well with our previous simulations [ 27 ], where MedeA VASP with the DFT framework and Meta-GGA with MBJLDA functionals were used.…”
Section: Density Of States For 4h-sic With Defectssupporting
confidence: 91%
“…The 4.5 Å neighborhood of the was relaxed using the force fields with the Tearsoft1998 [ 29 ] set of potentials. To verify the results obtained from the semi-empirical calculations, in Figure 6 line (b), we quote results from [ 27 ], line (c). We also calculated the DOS using the DFT-LCAO approach with GGA-PBEs functionals and the DFT-1/2 correction [ 8 ] for different sizes of the supercell, lines (d,e).…”
Section: Density Of States For 4h-sic With Defectsmentioning
confidence: 88%
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“…In addition to issues related to the development of highquality 4H-SiC epitaxial layers with low defect density, such as micropipes, stacking faults, carbon vacancies [4], one of the most important issues related to the development of highvoltage silicon carbide junction diodes is the appropriate design of the edge termination [5]. Properly designed edge termination allows to obtain uniform distribution of the electric field near the p-n junction at high reverse voltages, leading to increased values of the breakdown voltage, close to the theoretically ideal ones resulting from the electrophysical properties of silicon carbide.…”
Section: Introductionmentioning
confidence: 99%