Diamine-modified bismaleimide for toughening of UV-cured epoxy acrylate coating

Ouyang, Yufan; Zhang, Xiaorui; Shi, Jiahao; Yu, Yang; Liu, Laiweiqing; Jia, Zhiqiang; Wang, Qingye; Xu, Hang; Wang, Xiaoming

doi:10.1016/j.matchemphys.2023.128703

Materials Chemistry and Physics

2024

DOI: 10.1016/j.matchemphys.2023.128703

|View full text |Cite

Diamine-modified bismaleimide for toughening of UV-cured epoxy acrylate coating

Yufan Ouyang,

Xiaorui Zhang,

Jiahao Shi

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article4

Relationship

Self Cite0

Independent4

Authors

Journals

Cited by 4 publications

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Flexible bismaleimide resins based on bio‐based diamine: Synthesis and properties

Guo,

Huang,

Wang

et al. 2024

J of Applied Polymer Sci

View full text Add to dashboard Cite

The low toughness and high softening temperature of bismaleimide (BMI) resin limit its application in the field of electronic packaging. Herein, a series of flexible BMI resins with maleic anhydride terminated were synthesized via the imide reaction between dianhydrides and bio‐based 8,8′‐(4‐hexyl‐6‐octylcyclohexane‐1,3‐diyl)bis(octane‐1‐amine) (HOBOA). The degree of polymerization of these BMI resins was controlled to 1, 3, and 5 by adjusting the molar ratio of dianhydrides to HOBOA. These BMI resins show a low softening temperature below 100°C. These BMI resins were cured by the thermal procedure as follows: 145°C/2 h, 185°C/2 h, 225°C/2 h, and 275°C/2 h. The thermal decomposition temperature of cured resins is above 395°C. The tensile testing results demonstrated that cured resins exhibit a high elongation at break of around 60%. The dielectric constant of the cured resins is between 2.72 and 3.09 at room temperature. The water absorption rate of cured resins is less than 0.7% after being soaked in water for 30 days. After the cured resins were soaked separately in acid and alkali, the tensile strength retention rate reaches more than 90%. Additionally, the lap shear strength of cured resins coated on 7075 aluminum alloy exceeds 7.0 MPa.

show abstract

Flexible bismaleimide resins based on bio‐based diamine: Synthesis and properties

Guo,

Huang,

Wang

et al. 2024

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

Green synthesis of soybean oil-derived UV-curable resins for high-resolution 3D printing

Wang,

Cai,

et al. 2024

Additive Manufacturing

View full text Add to dashboard Cite

Photo-Cross-Linked Acrylate Resins Enabled by Tuning Various Flexible Diamine-Extended Species for High-Performance Printed Circuit Board Coatings

He,

Yang,

Tian

et al. 2024

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

The arrival of the 5G era requires that the solder resist coating of electronic chips involved in high-frequency communication technology has more promising comprehensive properties, including strong mechanical properties, high heat resistance, and voltage breakdown resistance. Herein, an efficient method was proposed to modify bisphenol A diglycidyl ether (DGEBA) with various diamine chain extenders, and five representative chain-extended DGEBA epoxy resins were constructed by introducing aliphatic and aromatic segments. On this basis, the epoxy-terminated resins were reacted with acrylic acid (AA) and then with tetrahydrophthalic anhydride (THPA) to produce photocurable resin with alkaline development. Owing to the high reactivity of amino groups, chain extension with diamines possesses the characteristics of a fast reaction under relatively mild conditions. The characteristic molecular structures (various numbers of rigid benzene rings or flexible aliphatic chains bonded with different numbers of ethers) of diamine profoundly affect the mechanical/thermal properties of the prepared UV-cured resins. The chain extension strategy is the key to striking a balance between high heat resistance and robust mechanical properties for traditional epoxy resins. The optimal UV-cured TPER-modified (P-BA) film manifests superior elongation at break (8.6%), robust toughness (4.1 MJ cm–3), and high heat resistance (T g = 141.8 °C). Furthermore, the practical application of the modified resin as the customized pattern of the solder resist coating was demonstrated, which is expected to provide important guiding significance for improving the multifunctional bisphenol A UV-curable epoxy resin.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Diamine-modified bismaleimide for toughening of UV-cured epoxy acrylate coating

Cited by 4 publications

References 29 publications

Flexible bismaleimide resins based on bio‐based diamine: Synthesis and properties

Flexible bismaleimide resins based on bio‐based diamine: Synthesis and properties

Green synthesis of soybean oil-derived UV-curable resins for high-resolution 3D printing

Photo-Cross-Linked Acrylate Resins Enabled by Tuning Various Flexible Diamine-Extended Species for High-Performance Printed Circuit Board Coatings

Contact Info

Product

Resources

About