Diamond coatings on tungsten carbide and their erosive wear properties

Solid particle erosion mechanisms of protective coatings for aerospace applications

“…It has also been reported that for ceramic materials where H p /H t < 1 and/or for low velocities, a micro-chipping mechanism was responsible for material loss [12,31,81]. However, these studies were conducted on bulk ceramic materials with many protruding crystals that are slowly chipped away by the impacting particles [31,81].…”

“…However, these studies were conducted on bulk ceramic materials with many protruding crystals that are slowly chipped away by the impacting particles [31,81]. In the case of our coatings, the surfaces have a mirror like finish prior to erosion meaning that this chipping mechanism cannot occur.…”

“…As discussed previously, the particle breakup may lead to very low erosion rates and it may cause a change in material loss mechanism. For low H p /H t ratios, a micro-chipping mechanism has been observed [12,31,81] but little information on this fracture process can be found. It has generally been characterized by a smooth surface after erosion when compared to the very rough surfaces resulting from lateral fracture.…”

“…The largest contribution in the field comes from Wheeler and Wood who have studied in detail the material removal mechanisms during high energy SPE of thick CVD diamond [81,[109][110][111][112][113][114][115][116][117][118][119][120]. interfacial (a) debonding [118] and (b) cracking [119].…”

“…Carbon-based films are predominantly thick diamond coatings deposited by chemical vapor deposition [81,108,117]. Due to their very high hardness, these have been found to be extremely resistant to SPE impact damage [108,118].…”