Diamond disc pad conditioning in chemical mechanical polishing

Li, Z.C.; Baisie, Emmanuel A.; Zhang, X.H.; Zhang, Q.

doi:10.1016/b978-0-08-100165-3.00013-9

Advances in Chemical Mechanical Planarization (CMP) 2016

DOI: 10.1016/b978-0-08-100165-3.00013-9

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Diamond disc pad conditioning in chemical mechanical polishing

Z.C. Li

Emmanuel A. Baisie

X.H. Zhang

et al.

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Cited by 2 publications

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“…With the diamonds on the conditioner cutting along pad surface, the topography is created and the capability of polishing pad is maintained. [2][3][4][5] Because the removal mechanism is highly correlated with pad surface roughness, the main purpose of the conditioning process is to maintain the proper surface roughness during mass production. [6][7][8][9][10][11][12] The topography and roughness can be influenced by the shape, size, and of arrangements diamond grits on the conditioner.…”

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confidence: 99%

Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP

Li¹,

Chen²,

Shiu³

et al. 2021

ECS J. Solid State Sci. Technol.

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Chemical Mechanical Polishing/Planarization (CMP) is the key process of the wafer and thin film planarization process for semiconductor manufacturing. In the CMP process, the pad can restore its surface topography and efficiency by diamond conditioner or named as diamond conditioning process. The pad surface roughness is essential to the removal rate in the CMP process because it can represent the contact level of the polishing pad and wafer. This study has developed a simulation program based on precise diamond-grits conditioning routes and numbers of cross points. By studying the OP (overlap cutting points) distribution in a specific area on the pad which is generated by CL (cutting locus), the trend of roughness parameters is discovered. The simulation and experimental model can be effective to observe pores deformation and predict pad surface topography. The results show the pad roughness would become steady over a certain OP number, and the OP can be precisely calculated and compared to the actual pad surface. The final results of the break-in and pad conditioning process can be estimated or further optimized. The other high-density and customized diamond-grits arrangement of conditioner can be designed according to the study in future work.

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mentioning

confidence: 99%

Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP

Li¹,

Chen²,

Shiu³

et al. 2021

ECS J. Solid State Sci. Technol.

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show abstract

Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool

Chen

Pham

et al. 2017

Int J Adv Manuf Technol

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Diamond disc pad conditioning in chemical mechanical polishing

Cited by 2 publications

References 34 publications

Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP

Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP

Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool

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