A H-terminated surface conductive layer of B-doped diamond on a (111) surface was used to fabricate a metal-oxide-semiconductor field-effect transistor (MOSFET) using an electron beam evaporated SiO 2 or Al 2 O 3 gate insulator and a Cu-metal stacked gate. When the bulk carrier concentration was approximately 10 15 /cm 3 and the B-doped diamond layer was 1.5 lm thick, the surface carrier mobility of the H-terminated surface on the (111) diamond before FET processing was 35 cm 2 /Vs and the surface carrier concentration was 1.5 9 10 13 /cm 2 . For the SiO 2 gate (0.76 lm long and 50 lm wide), the maximum measured drain current at a gate voltage of À3.0 V was À75 mA/mm and the maximum transconductance was 24 mS/mm, and for the Al 2 O 3 gate (0.64 lm long and 50 lm wide), these features were À86 mA/mm and 15 mS/ mm, respectively. These values are among the highest reported direct-current (DC) characteristics for a diamond homoepitaxial (111) MOSFET.