Diamonds brazing with a novel Cu35Ni35Cr10Fe10Sn10 high‐entropy alloy filler
Haifeng Wei,
Hui Zhang,
Dong Xu
et al.
Abstract:A novel Cu35Ni35Cr10Fe10Sn10 high‐entropy alloy (HEA) filler with a relatively low melting point (935°C) was designed for brazing diamonds, and its technical advantages over conventional NiCr‐based fillers, that is, favorable wettability, high bonding strength, low thermal damage, and high mechanical performance, were convincingly demonstrated. The newly developed HEA filler had a contact angle of only 11° on the graphite (energetically close to diamond) surface and it could braze diamonds at 1000°C, much lowe… Show more
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